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Progress In Electromagnetics Research
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A SPICE COMPATIBLE MODEL OF ON-WAFER COUPLED INTERCONNECTS FOR CMOS RFICs

By X. Shi, K. S. Yeo, W. M. Lim, M. A. Do, and C. C. Boon

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Abstract:
This paper investigates the properties of the on-wafer coupled interconnects built in a 0.18 μm CMOS technology for RF applications. A SPICE compatible equivalent circuit model is developed. The proposed model is an extension of a 2-Ⅱ equivalent circuit model for single-line interconnects by adding two coupling components. The model parameters are extracted from four-port S-parameter simulation results through a calibrated electromagnetic (EM) simulator, i.e. HFSS. The accuracy of the model is validated from 500 MHz to 20 GHz.

Citation:
X. Shi, K. S. Yeo, W. M. Lim, M. A. Do, and C. C. Boon, "A SPICE compatible model of on-wafer coupled interconnects for CMOS rfics," Progress In Electromagnetics Research, Vol. 102, 287-299, 2010.
doi:10.2528/PIER10010608
http://www.jpier.org/PIER/pier.php?paper=10010608

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