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Progress In Electromagnetics Research
ISSN: 1070-4698, E-ISSN: 1559-8985
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SIMPLE, TAYLOR-BASED WORST-CASE MODEL FOR FIELD-TO-LINE COUPLING

By S. T. Op 't Land, M. Ramdani, R. Perdriau, M. Leone, and M. Drissi

Full Article PDF (496 KB)

Abstract:
To obtain Electromagnetic Compatibility (EMC), we would like to study the worst-case electromagnetic eld-induced voltages at the ends of Printed Circuit Board (PCB) traces. With increasing frequencies, modelling these traces as electrically short no longer suffices. Accurate long line models exist, but are too complicated to easily induce the worst case. Therefore, we need a simple analytical model. In this article, we predict the terminal voltages of an electrically long, two-wire transmission line with characteristic loads in vacuum, excited by a linearly polarised plane wave. The model consists of a short line model (one Taylor cell) with an intuitive correction factor for long line effects: the modified Taylor cell. We then adapt the model to the case of a PCB trace above a ground plane, illuminated by a grazing, vertically polarised wave. For this case, we prove that end-fire illumination constitutes the worst case. We derive the worst-case envelope and try to falsify it by measurement in a Gigahertz Transverse Electromagnetic (GTEM) cell.

Citation:
S. T. Op 't Land, M. Ramdani, R. Perdriau, M. Leone, and M. Drissi, "Simple, Taylor-Based Worst-Case Model for Field-to-Line Coupling," Progress In Electromagnetics Research, Vol. 140, 297-311, 2013.
doi:10.2528/PIER13041207
http://www.jpier.org/PIER/pier.php?paper=13041207

References:
1. Lagos, J. L. and F. L. Fiori, "Worst-case induced disturbances in digital and analog interchip interconnects by an external electromagnetic plane wave --- Part I: Modeling and algorithm," IEEE Transactions on Electromagnetic Compatibility, Vol. 99, 1-7, 2010.

2. Magdowski, M. and R. Vick, "Closed-form formulas for the stochastic electromagnetic field coupling to a transmission line with arbitrary loads," IEEE Transactions on Electromagnetic Compatibility, Vol. 99, 1-7, 2012.

3. Nucci, C. A., F. Rachidi, and M. Rubinstein, "An overview of field-to-transmission line interaction," Applied Computational Electromagnetics Society Newsletter, Vol. 22, No. 1, 9-27, 2007.

4. Paul, C. R., Introduction to Electromagnetic Compatibility, Wiley, 2008.

5. Leone, M. and H. L. Singer, "On the coupling of an external electromagnetic field to a printed circuit board trace," IEEE Transactions on Electromagnetic Compatibility, Vol. 41, No. 4, 418-424, Nov. 1999.
doi:10.1109/15.809842

6. Mandic, T., R. Gillon, B. Nauwelaers, and A. Baric, "Characterizing the TEM cell electric and magnetic field coupling to PCB transmission lines," IEEE Transactions on Electromagnetic Compatibility, Vol. 54, No. 5, 976-985, Oct. 2012.
doi:10.1109/TEMC.2012.2193888

7. Taylor, C. D., R. S. Satterwhite, C. W. Harrison, and Jr., "The response of a terminated two-wire transmission line excited by a nonuniform electromagnetic field," IEEE Transactions on Antennas and Propagation, Vol. 13, No. 6, 987-989, Nov. 1965.
doi:10.1109/TAP.1965.1138574

8. Agrawal, A. K., H. J. Price, and S. H. Gurbaxani, "Transient response of multiconductor transmission lines excited by a nonuni-form electromagnetic field," IEEE Transactions on Electromagnetic Compatibility, Vol. 22, No. 2, 119-129, May 1980.
doi:10.1109/TEMC.1980.303824

9. Rachidi, F., "Formulation of the field-to-transmission line coupling equations in terms of magnetic excitation field," IEEE Transactions on Electromagnetic Compatibility, Vol. 35, No. 3, 404-407, Aug. 1993.
doi:10.1109/15.277316

10. IEC 62132-2, Integrated circuits --- Measurement of electromagnetic immunity 150 kHz to 1 GHz --- Part 2: Measurement of radiated immunity-TE, Jul. 2004.


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