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2011-01-27

Impedance Matching Capability of Novel Socket Contactor Design Using Variable Open Stubfor RF Packaging Testing

By Sung-Mao Wu, Kao-Yi Wang, and Chuan-Hau Liu
Progress In Electromagnetics Research, Vol. 113, 67-82, 2011
doi:10.2528/PIER10121501

Abstract

In this paper, we will propose a new structure of the socket contactor, which is applied to the lead-frame test board. This structure contains a variable open stub to suffice for matching the impedance between the package and the load board. Its electrical property is considered superior to a conventional spring probe's especially when it is applied to a QFP device. In the following paragraphs, we will present its equivalent model and go into details. Note that the transmission-line model is a substitute for a physical structure at this point. First of all, its RLC model will be constructed after we demonstrate its simulation and test data. Finally, we will use the so-called MonteCarlo Method to analyze the inaccurate length in manufacturing to see how this new structure works.

Citation


Sung-Mao Wu, Kao-Yi Wang, and Chuan-Hau Liu, "Impedance Matching Capability of Novel Socket Contactor Design Using Variable Open Stubfor RF Packaging Testing," Progress In Electromagnetics Research, Vol. 113, 67-82, 2011.
doi:10.2528/PIER10121501
http://www.jpier.org/PIER/pier.php?paper=10121501

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