Vol. 13

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Effects of DC-Bias Conditions on Low-Loss Thin Film Microstrip Line

By Hung-Wei Wu and Min-Hang Weng
Progress In Electromagnetics Research C, Vol. 13, 19-32, 2010


This paper presents the microwave characteristics of thin film microstrip line (TFML) under dc-bias conditions. The proposed TFML with 20 μm thick polyimide layer is used as a thin dielectric supporter on low-resistivity silicon (LRS) substrate. Measured frequency-dependent microwave characteristics and equivalent lumped elements are evaluated for the dc-biased TFML over 1-50 GHz. This work presents acceptable attenuation of 0.561, 0.563 and 0.565 dB/mm at 50 GHz with dc-bias conditions, showing that the TFML can be used for high frequency interconnects for any 3D-based microwave devices and monolithic microwave integrated circuits (MMICs).


Hung-Wei Wu and Min-Hang Weng, "Effects of DC-Bias Conditions on Low-Loss Thin Film Microstrip Line," Progress In Electromagnetics Research C, Vol. 13, 19-32, 2010.


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