Vol. 20
Latest Volume
All Volumes
PIERC 127 [2022] PIERC 126 [2022] PIERC 125 [2022] PIERC 124 [2022] PIERC 123 [2022] PIERC 122 [2022] PIERC 121 [2022] PIERC 120 [2022] PIERC 119 [2022] PIERC 118 [2022] PIERC 117 [2021] PIERC 116 [2021] PIERC 115 [2021] PIERC 114 [2021] PIERC 113 [2021] PIERC 112 [2021] PIERC 111 [2021] PIERC 110 [2021] PIERC 109 [2021] PIERC 108 [2021] PIERC 107 [2021] PIERC 106 [2020] PIERC 105 [2020] PIERC 104 [2020] PIERC 103 [2020] PIERC 102 [2020] PIERC 101 [2020] PIERC 100 [2020] PIERC 99 [2020] PIERC 98 [2020] PIERC 97 [2019] PIERC 96 [2019] PIERC 95 [2019] PIERC 94 [2019] PIERC 93 [2019] PIERC 92 [2019] PIERC 91 [2019] PIERC 90 [2019] PIERC 89 [2019] PIERC 88 [2018] PIERC 87 [2018] PIERC 86 [2018] PIERC 85 [2018] PIERC 84 [2018] PIERC 83 [2018] PIERC 82 [2018] PIERC 81 [2018] PIERC 80 [2018] PIERC 79 [2017] PIERC 78 [2017] PIERC 77 [2017] PIERC 76 [2017] PIERC 75 [2017] PIERC 74 [2017] PIERC 73 [2017] PIERC 72 [2017] PIERC 71 [2017] PIERC 70 [2016] PIERC 69 [2016] PIERC 68 [2016] PIERC 67 [2016] PIERC 66 [2016] PIERC 65 [2016] PIERC 64 [2016] PIERC 63 [2016] PIERC 62 [2016] PIERC 61 [2016] PIERC 60 [2015] PIERC 59 [2015] PIERC 58 [2015] PIERC 57 [2015] PIERC 56 [2015] PIERC 55 [2014] PIERC 54 [2014] PIERC 53 [2014] PIERC 52 [2014] PIERC 51 [2014] PIERC 50 [2014] PIERC 49 [2014] PIERC 48 [2014] PIERC 47 [2014] PIERC 46 [2014] PIERC 45 [2013] PIERC 44 [2013] PIERC 43 [2013] PIERC 42 [2013] PIERC 41 [2013] PIERC 40 [2013] PIERC 39 [2013] PIERC 38 [2013] PIERC 37 [2013] PIERC 36 [2013] PIERC 35 [2013] PIERC 34 [2013] PIERC 33 [2012] PIERC 32 [2012] PIERC 31 [2012] PIERC 30 [2012] PIERC 29 [2012] PIERC 28 [2012] PIERC 27 [2012] PIERC 26 [2012] PIERC 25 [2012] PIERC 24 [2011] PIERC 23 [2011] PIERC 22 [2011] PIERC 21 [2011] PIERC 20 [2011] PIERC 19 [2011] PIERC 18 [2011] PIERC 17 [2010] PIERC 16 [2010] PIERC 15 [2010] PIERC 14 [2010] PIERC 13 [2010] PIERC 12 [2010] PIERC 11 [2009] PIERC 10 [2009] PIERC 9 [2009] PIERC 8 [2009] PIERC 7 [2009] PIERC 6 [2009] PIERC 5 [2008] PIERC 4 [2008] PIERC 3 [2008] PIERC 2 [2008] PIERC 1 [2008]
2011-03-25
A Compact Package with Integrated Patch Antenna for Single-Chip 60-GHz Radios
By
Progress In Electromagnetics Research C, Vol. 20, 227-238, 2011
Abstract
This paper presents the development of a standard surface mountable ceramic ball grid array (CBGA) package with an integrated patch antenna in low temperature cofired ceramic (LTCC) technology for emerging single-chip 60-GHz radios. It addresses the challenges of low-loss wire bonding interconnections required between the chip and the antenna as well as the package to allow efficient utilization of available space for miniaturization. The compact package of size 12.5×8×1.265 mm3 achieves good electrical performance. For instance, the package part exhibits insertion loss <0.08 dB, return loss >22 dB, and attenuation rate <0.2 dB/cm below 5 GHz; while the antenna part demonstrates 8-GHz impedance bandwidth and 8±2 dBi peak realized gain at 60 GHz. Simulated and measured results are compared. They agree reasonably well, indicating the feasibility of designing and manufacturing the integrated antenna package in LTCC for millimeter-wave applications.
Citation
Lai Lai Wai Kai Meng Chua Albert Chee Wai Lu Mei Sun Yue-Ping Zhang , "A Compact Package with Integrated Patch Antenna for Single-Chip 60-GHz Radios," Progress In Electromagnetics Research C, Vol. 20, 227-238, 2011.
doi:10.2528/PIERC11011502
http://www.jpier.org/PIERC/pier.php?paper=11011502
References

1. http://www.ieee802.org/15/pub/TG3c.html.
doi:10.1109/TMTT.2006.877832

2., http://domino.watson.ibm.com/comm/research projects.nsf/pages/mmwave.sixtygig.html.
doi:10.1109/LMWC.2010.2103932

3. http://www.sibeam.com/.

4. Pfeiffer, U., J. Grzyp, D. Liu, B. Gaucher, T. Beukema, B. Floyd, and S. Reynolds, "A chip-scale packaging technology for 60-GHz wireless chipsets," IEEE Trans. Microw. Theory Tech., Vol. 54, No. 8, 3387-3397, August 2006.
doi:10.1049/el:20020937

5. Kam, D. G., et al., "LTCC packages with embedded phased-array antennas for 60 GHz communications," IEEE Microw. Wireless Compon. Lett., Vol. 21, No. 3, 142-144, March 2011.

6. Zhang, Y. P., T. K. C. Lo, and Y. Hwang, A dielectric loaded miniature antenna for microcellular and personal communications, Proc. of IEEE Antenna Propagat. Symp., 1152-1155, Newport Beach, California, USA, June 18-23, 1995.
doi:10.1109/TAP.2004.834427

7. Zhang, Y. P., "Integration of microstrip antenna on cavity-down ceramic ball grid array package," Electronics Lett., Vol. 38, No. 22, 1307-1308, October 2002.
doi:10.1109/TAP.2006.879191

8. Ryckaert, J., et al., "Single-package 5 GHz WLAN RF module with embedded patch antenna and 20dBm power amplifier," Digest of IEEE MTT-S Int. Symp., 1037-1040, 2003.

9. Zhang, Y. P., "Integrated ceramic ball grid array package antenna," IEEE Trans Antennas Propagat., Vol. 52, No. 10, 2538-2544, October 2004.
doi:10.1049/el:20083352

10. Wi, S. H., et al., "Package-level integrated antennas based on LTCC technology," IEEE Trans. Antennas Propagat., Vol. 54, No. 8, 2190-2197, 2006.

11. Tsutsumi, Y., et al., A triangular loop antenna mounted adjacent to a lossy Si substrate for millimeter-wave wireless PAN, Proc. of IEEE Antenna Propagat. Symp., 1008-1011, Honolulu, Hawaii, USA, June 10-15, 2007.
doi:10.1109/TAP.2008.927577

12. Zhang, Y. P., M. Sun, K. M. Chua, L. L. Wai, and D. Liu, "Integration of slot antenna in LTCC package for 60-GHz radios," Electronics Lett., Vol. 44, No. 5, 330-331, March 2008.
doi:10.1109/TAP.2009.2029290

13. Yoshida, S., K. Tsubouchi, A. Tosaki, H. Oguma, S. Kameda, H. Nakase, and T. Takagi, Radiation characteristics of ultra-small wireless communication modules for 60 GHz band WPAN, Proc. IEEE Antenna Propagat. Symp., San Diego, California, USA, July 5-12, 2008.
doi:10.1109/TAP.2009.2029295

14. Sun, M., Y. P. Zhang, K. M. Chua, L. L. Wai, D. X. Liu, and B. Gaucher, "Integration of Yagi antenna in LTCC package for differential 60-GHz radio," IEEE Trans. Antennas Propagat., Vol. 56, No. 8, 2780-2783, August 2008.
doi:10.1109/LAWP.2009.2039031

15. Zhang, Y. P., M. Sun, K. M. Chua, L. L. Wai, and D. Liu, "Antenna-in-package design for wirebond interconnection to highly-integrated 60-GHz radios ," IEEE Trans. Antennas Propagat., Vol. 57, No. 10, 2842-2852, October 2009.
doi:10.2528/PIER09012901

16. Zhang, Y. P. and D. Liu, "Antenna-on-chip and antenna-in-package solutions to highly-integrated millimeter-wave devices for wireless communications," IEEE Trans. Antennas Propagat., Vol. 57, No. 10, 2830-2841, October 2009.
doi:10.2528/PIER09080204

17. Sun, M., Y. P. Zhang, Y. X. Guo, K. M. Chua, and L. L. Wai, "Integration of grid array antenna in chip package for highly integrated 60-GHz radios ," IEEE Antennas Wireless Propagat. Lett., Vol. 8, 1364-1366, 2009.
doi:10.1109/22.915447

18. Kasabegoudar, V. G. and K. J. Vinoy, "A broadband suspended microstrip antenna for circular polarization," Progress In Electromagnetics Research, Vol. 90, 353-368, 2009.

19. Islam, M. T., M. N. Shakib, and N. Misran, "Design analysis of high gain wideband L-probe FED microstrip patch antenna," Progress In Electromagnetics Research, Vol. 95, 397-407, 2009.
doi:10.2528/PIER09040701

20. Budka, T. P., "Wide-bandwidth millimeter-wave bond-wire interconnects," IEEE Trans. Microw. Theory Tech., Vol. 49, No. 4, 715-718, April 2001.
doi:10.1163/156939309788019949

21. Sun, Y., S. Glisic, F. Herzel, K. Schmalz, E. Grass, W. Winkler, and R. Kraemer, "An integrated 60 GHz transceiver front end for OFDM in SiGe: BiCMOS," Wireless World Research Forum 16, Shanghai, China, April 26-28, 2006.
doi: --- Either ISSN/ISBN or Series/Volume title must be supplied.

22. Wang, Z., P. Li, R.-M. Xu, and W. Lin, "A compact X-band receiver front-end module based on low temperature co-fired ceramic technology," Progress In Electromagnetics Research, Vol. 92, 167-180, 2009.
doi: --- Either first page or author must be supplied.

23. Shireen, R., S. Shi, and D. W. Prather, "Wideband millimeter-wave bow-tie antenna," Journal of Electromagnetic Waves and Applications, Vol. 23, No. 5-6, 737-746, 2009.
doi: --- Either ISSN/ISBN or Series/Volume title must be supplied.