Vol. 42

Front:[PDF file] Back:[PDF file]
Latest Volume
All Volumes
All Issues
2013-08-03

Conducted Emission Measurement of a Cell Phone Processor Module

By Fayu Wan, Jun-Xiang Ge, and Mengxiang Qu
Progress In Electromagnetics Research C, Vol. 42, 191-203, 2013
doi:10.2528/PIERC13060705

Abstract

This paper discusses a conducted emission measurement of a cell phone integrated circuit. The industry standard measurement method is used to compare the measurement result to the defined limit line. A data analysis method-short time fast Fourier transform (STFFT) is presented to help to analyze the result. The data consistency and repeatability is also analyzed.

Citation


Fayu Wan, Jun-Xiang Ge, and Mengxiang Qu, "Conducted Emission Measurement of a Cell Phone Processor Module," Progress In Electromagnetics Research C, Vol. 42, 191-203, 2013.
doi:10.2528/PIERC13060705
http://www.jpier.org/PIERC/pier.php?paper=13060705

References


    1. Bendhia, S., M. Ramdani, and E. Sicard, Electromagnetic Compatibility of Integrated Circuits: Techniques for Low Emission and Susceptibility, Springer-Verlag, Berlin, Germany, 2006.
    doi:10.1007/b137864

    2. Ramdani, M., et al., "The electromagnetic compatibility of integrated circuits --- Past, present and future," IEEE Trans. on Electromagnetic Compatibility, Vol. 51, No. 1, 78-100, Feb. 2009.
    doi:10.1109/TEMC.2008.2008907

    3. IEC, "IEC 61967-4, integrated circuits --- Measurement of electromagnetic emissions 150 kHz to 1 GHz --- Part 4: Measurement of conducted emissions ---1 Ω/150 Ω direct coupling method,"-2005.
    doi:10.1109/TEMC.2008.2008907

    4. BISS, "Generic IC EMC test specification version 1.2,", Jan. 2010.

    5. Ramanujan, A., Z. Riah, A. Louis, and B. Mazari, "Computational optimizations towards an accurate and rapid electromagnetic emission modeling," Progress In Electromagnetics Research B, Vol. 27, 365-384, 2011.

    6. Pan, W. and D. Pommerenke, "EMI failure analysis techniques: II. Joint time-frequency analysis," IEEE EMC Society News Letter, Vol. 226, No. 2010, 31-34, 2010.

    7. Ross, B., "IBIS models for signal integrity applications," Electrical Engineering Times, 38-43, Sep. 2, 1996.

    8. Tchrani, P. F., Y. Z. Chen, and J. Y. Fang, "Extraction of transient behavioral model of digital I/O buffers from IBIS," 46th IEEE Electronic Components & Technology Conference, 1009-1015, Orlando, May 28-31, 1996.

    9. Tuinenga, P. W., SPICE: A Guide to Circuit Simulation & Analysis Using PSpice, Englewood Cliffs, Prentice-Hall, NJ, 1992.