Vol. 5
Latest Volume
All Volumes
PIERL 108 [2023] PIERL 107 [2022] PIERL 106 [2022] PIERL 105 [2022] PIERL 104 [2022] PIERL 103 [2022] PIERL 102 [2022] PIERL 101 [2021] PIERL 100 [2021] PIERL 99 [2021] PIERL 98 [2021] PIERL 97 [2021] PIERL 96 [2021] PIERL 95 [2021] PIERL 94 [2020] PIERL 93 [2020] PIERL 92 [2020] PIERL 91 [2020] PIERL 90 [2020] PIERL 89 [2020] PIERL 88 [2020] PIERL 87 [2019] PIERL 86 [2019] PIERL 85 [2019] PIERL 84 [2019] PIERL 83 [2019] PIERL 82 [2019] PIERL 81 [2019] PIERL 80 [2018] PIERL 79 [2018] PIERL 78 [2018] PIERL 77 [2018] PIERL 76 [2018] PIERL 75 [2018] PIERL 74 [2018] PIERL 73 [2018] PIERL 72 [2018] PIERL 71 [2017] PIERL 70 [2017] PIERL 69 [2017] PIERL 68 [2017] PIERL 67 [2017] PIERL 66 [2017] PIERL 65 [2017] PIERL 64 [2016] PIERL 63 [2016] PIERL 62 [2016] PIERL 61 [2016] PIERL 60 [2016] PIERL 59 [2016] PIERL 58 [2016] PIERL 57 [2015] PIERL 56 [2015] PIERL 55 [2015] PIERL 54 [2015] PIERL 53 [2015] PIERL 52 [2015] PIERL 51 [2015] PIERL 50 [2014] PIERL 49 [2014] PIERL 48 [2014] PIERL 47 [2014] PIERL 46 [2014] PIERL 45 [2014] PIERL 44 [2014] PIERL 43 [2013] PIERL 42 [2013] PIERL 41 [2013] PIERL 40 [2013] PIERL 39 [2013] PIERL 38 [2013] PIERL 37 [2013] PIERL 36 [2013] PIERL 35 [2012] PIERL 34 [2012] PIERL 33 [2012] PIERL 32 [2012] PIERL 31 [2012] PIERL 30 [2012] PIERL 29 [2012] PIERL 28 [2012] PIERL 27 [2011] PIERL 26 [2011] PIERL 25 [2011] PIERL 24 [2011] PIERL 23 [2011] PIERL 22 [2011] PIERL 21 [2011] PIERL 20 [2011] PIERL 19 [2010] PIERL 18 [2010] PIERL 17 [2010] PIERL 16 [2010] PIERL 15 [2010] PIERL 14 [2010] PIERL 13 [2010] PIERL 12 [2009] PIERL 11 [2009] PIERL 10 [2009] PIERL 9 [2009] PIERL 8 [2009] PIERL 7 [2009] PIERL 6 [2009] PIERL 5 [2008] PIERL 4 [2008] PIERL 3 [2008] PIERL 2 [2008] PIERL 1 [2008]
2008-12-17
Analysis and Suppression on Simultaneous Switching Noise Coupling Between Multi-Cavities for Multilayer Pcbs
By
Progress In Electromagnetics Research Letters, Vol. 5, 167-174, 2008
Abstract
In this letter, an easy concept to eliminate the simultaneous switching noise (SSN) in multilayer board is proposed. Use of the low impedance element provides a short path to lead noise to ground, called virtual shield. This method could effectively suppress the first mode of the parallel resonance, and the wider-band suppression could be obtained by array short via. It is also proved that the virtual shield concept has to be placed as the excited source at the same layer.
Citation
Chin-Sheng Chang Mau-Phon Houng Ding-Bing Lin Kuo-Chiang Hung Ray-Fong Hong , "Analysis and Suppression on Simultaneous Switching Noise Coupling Between Multi-Cavities for Multilayer Pcbs," Progress In Electromagnetics Research Letters, Vol. 5, 167-174, 2008.
doi:10.2528/PIERL08112501
http://www.jpier.org/PIERL/pier.php?paper=08112501
References

1. Chen, R. L., C. Ji, T. H. Hubing, and S. Weimin, "Analytical model for the rectangular power-ground structure including radiation loss ," IEEE Transactions on Electromagnetic Compatibility, Vol. 47, No. 1, 10-16, 2005.
doi:10.1109/TEMC.2004.842204

2. Chen, J., T. H. Hubing, T. P. V. Doren, and R. E. DuBroff, "Power bus isolation using power islands in printed circuit boards," IEEE Transactions on Electromagnetic Compatibility, Vol. 44, No. 2, 373-380, 2002.
doi:10.1109/TEMC.2002.1003403

3. Wan, L., P. M. Raj, D. Balaraman, P. Muthana, S. K. Bhattacharya, M. Varadarajan, I. R. Abothu, M. Swaminathan, and R. Tummala, "Embedded decoupling capacitor performance in high speedcircuits," Electronic Components and Technology, IEEE ECTC Proceedings, Vol. 2, 1617-1622, 2005.

4. Wu, T. L., S. T. Chen, J. N. Hwang, and Y. H. Lin, "Numerical andexp erimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speedd igital PCB," IEEE Transactions on Electromagnetic Compatibility, Vol. 46, No. 1, 33-45, 2004.
doi:10.1109/TEMC.2004.823680

5. Chang, C. S., D. B. Lin, K. C. Hung, I. T. Tang, and M. P. Houng, "Simultaneous switching noise mitigation capability with low parasitic effect using aperiodic high-impedance surface structure," Progress In Electromagnetics Research Letters, Vol. 4, 149-158, 2008.
doi:10.2528/PIERL08082902

6. Wounchoum, P., D. Worasawate, C. Phongcharoenpanich, and M. Krairiksh, "A two-slot array antenna on a concentric sectoral cylindrical cavity excited by a coupling slot," Progress In Electromagnetics Research, Vol. 86, 135-154, 2008.
doi:10.2528/PIER08091204

7. Sadat, S., M. Fardis, F. G. Gharakhili, and G. Dadashzadeh, "A compact microstrip square-ring slot antenna for UWB applications," Progress In Electromagnetics Research, Vol. 67, 173-179, 2007.
doi:10.2528/PIER06082901

8. Das, S., A. Chakrabarty, and A. Chakraborty, "Characteristics of an offset longitudinal/transverse slot coupled crossed waveguide junction using multiple cavity modeling technique considering the TE00 mode at the slot aperture," Progress In Electromagnetics Research, Vol. 67, 297-316, 2007.
doi:10.2528/PIER06092701

9. Lee, J., Y. M. Seng, M. K. Iyer, and J. Kim, "Investigation of plane-to-plane noise coupling through cutout in multi-layer power-ground planes," IEEE Electronics Packaging Technology Conference, 257-260, 2002.

10. Leone, M., "The radiation of a rectangular power-bus structure at multiple cavity-mode resonances," IEEE Transactions on Electromagnetic Compatibility, Vol. 45, 486-492, 2003.
doi:10.1109/TEMC.2003.815560

11. Wu, C. T., G. H. Shiue, S. M. Lin, and R. B. Wu, "Composite effects of reflections and ground bounce for signal line through a split power plane ," IEEE Transactions on Advanced Packaging, Vol. 25, No. 2, 297-301, 2002.
doi:10.1109/TADVP.2002.803263

12. Antonini, G., A. C. Scogna, A. Orlandi, and V. Ricchiuti, "Cross-SSN analysis in multilayer printed circuit boards," IEEE International Symposium on Electromagnetic Compatibility, Vol. 3, 705-710, 2005.

13. Lee, J., M. D. Rotaru, M. K. Iyer, H. Kim, and J. Kim, "Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs," IEEE Transactions on Advanced Packaging, Vol. 28, 298-309, 2005.
doi:10.1109/TADVP.2005.846932