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2021-12-02
Spur-Less Interdigital Metal-Insulator-Metal Capacitor
By
Progress In Electromagnetics Research Letters, Vol. 101, 49-54, 2021
Abstract
A wideband interdigital Metal-insulator-metal (MIM) capacitor is created and built in a two-layer low temperature co-fired ceramic (LTCC) substrate. To reduce the amount of stopbands and eliminate unexpected spurs which restrict the bandwidth, short-interconnection that interconnects the open ends of interval fingers is proposed. The increment of bandwidth and capacitance of the proposed interdigital MIM capacitor is 206% and 25%, respectively. The proposed interdigital capacitor has a wider frequency applicational range and a compact size of only 8.2×6.2 mm. Performance discussion and comparisons are also carried out.
Citation
Na Xie Huanyan Tie Qiang Ma Bo Zhou , "Spur-Less Interdigital Metal-Insulator-Metal Capacitor," Progress In Electromagnetics Research Letters, Vol. 101, 49-54, 2021.
doi:10.2528/PIERL21100101
http://www.jpier.org/PIERL/pier.php?paper=21100101
References

1. Chen, H.-Y., S.-S. Li, and M.-H. Li, "A low impedance CMOS-MEMS capacitive resonator based on metal-insulator-metal (MIM) capacitor structure," IEEE Electron Device Letters, Vol. 42, No. 7, 1045-1048, 2021.
doi:10.1109/LED.2021.3081365

2. Page, J. E., E. Marquez-Segura, F. P. Casares-Miranda, J. Esteban, P. Otero, and C. Camacho-Penalosa, "Exact analysis of the wire-bonded multiconductor transmission line," IEEE Trans. Microw. Theory Tech., Vol. 88, No. 8, 1585-1592, 2007.
doi:10.1109/TMTT.2007.902084

3. Zhou, B., C. Li, L. Qian, Y. Wang, and Z. Zhang, "Broadband vertically interdigital-capacitor with high frequency response improving," Microwave and Optical Technology Letters, Vol. 62, No. 12, 3779-3784, 2020.
doi:10.1002/mop.32522

4. Casares-Miranda, F. P., P. Otero, E. Marquez-Segura, and C. Camacho Penalosa, "Wire bonded interdigital capacitor," IEEE Microw. Wirel. Compon. Lett., Vol. 15, No. 10, 700-702, 2005.
doi:10.1109/LMWC.2005.856835

5. Bo, Z., W. Sheng, and Y. Zheng, "Miniaturized lumped-element LTCC filter with spurious spikes suppressed vertically-interdigital-capacitors," IEEE Microw. Wirel. Compon. Lett., Vol. 24, No. 10, 692-694, 2014.
doi:10.1109/LMWC.2014.2342935

6. Zhou, B., L. Huang, Q. Chen, X. Ni, X. Li, N. Wang, and Z. Cai, "Wideband vertically-interdigital capacitor," Proceedings of 2018 IEEE CPMT Symposium Japan (ICSJ), 201-204, Japan, 2018.
doi:10.1109/ICSJ.2018.8602517