Vol. 101

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2021-12-02

Spur-Less Interdigital Metal-Insulator-Metal Capacitor

By Na Xie, Huanyan Tie, Qiang Ma, and Bo Zhou
Progress In Electromagnetics Research Letters, Vol. 101, 49-54, 2021
doi:10.2528/PIERL21100101

Abstract

A wideband interdigital Metal-insulator-metal (MIM) capacitor is created and built in a two-layer low temperature co-fired ceramic (LTCC) substrate. To reduce the amount of stopbands and eliminate unexpected spurs which restrict the bandwidth, short-interconnection that interconnects the open ends of interval fingers is proposed. The increment of bandwidth and capacitance of the proposed interdigital MIM capacitor is 206% and 25%, respectively. The proposed interdigital capacitor has a wider frequency applicational range and a compact size of only 8.2×6.2 mm. Performance discussion and comparisons are also carried out.

Citation


Na Xie, Huanyan Tie, Qiang Ma, and Bo Zhou, "Spur-Less Interdigital Metal-Insulator-Metal Capacitor," Progress In Electromagnetics Research Letters, Vol. 101, 49-54, 2021.
doi:10.2528/PIERL21100101
http://www.jpier.org/PIERL/pier.php?paper=21100101

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