Vol. 71

Front:[PDF file] Back:[PDF file]
Latest Volume
All Volumes
All Issues
2018-07-30

Chip-Package Co-Design for Optimization of 5.8 GHz LNA Performance Based on Embedded Inductors

By Haiyan Sun, Wenjun Sun, Ling Sun, Jicong Zhao, Yihong Peng, Jiaen Fang, Xiaoyong Miao, and Honghui Wang
Progress In Electromagnetics Research M, Vol. 71, 95-105, 2018
doi:10.2528/PIERM18051403

Abstract

This paper presents the design and demonstration of an optimized land grid array (LGA) structure for low noise amplifier (LNA). In order to achieve better circuit performance, the novel chip-package co-design method based on embedded inductors is used. The optimized structure is accurately modeled by ANSYS software. S-parameter is utilized to help in understanding the contributing to the optimized LGA structure. The simulation results for the novel LNA co-design structure show the gain 14.35 dB (> 10 dB), input reflection coefficient -15.63 dB (< -10 dB), output reflection coefficient -24.43 dB (< -10 dB), reverse-isolation -44.7 dB (< -20 dB), and noise figure 2.99 dB (< 4 dB), and indicate that the optimized LGA structure based on embedded inductors is fully capable of supporting 5.8 GHz LNA application.

Citation


Haiyan Sun, Wenjun Sun, Ling Sun, Jicong Zhao, Yihong Peng, Jiaen Fang, Xiaoyong Miao, and Honghui Wang, "Chip-Package Co-Design for Optimization of 5.8 GHz LNA Performance Based on Embedded Inductors," Progress In Electromagnetics Research M, Vol. 71, 95-105, 2018.
doi:10.2528/PIERM18051403
http://www.jpier.org/PIERM/pier.php?paper=18051403

References


    1. Lin, Y. C., W. H. Lee, T. S. Horng, and L. T. Hwang, "Full chip-package-board co-design of broadband QFN bonding transition using backside via and defected ground structure," IEEE Transactions on Components Packaging & Manufacturing Technology, Vol. 4, No. 9, 1470-1479, 2017.

    2. Yeh, H. C., C. C. Chiong, S. Aloui, and H. Wang, "Analysis and design of millimeter-wave low-voltage CMOS cascode LNA with magnetic coupled technique," IEEE Transactions on Microwave Theory & Techniques, Vol. 60, No. 12, 4066-4079, 2012.
    doi:10.1109/TMTT.2012.2224365

    3. Li, L., K. Ma, and S. Mou, "Modeling of new spiral inductor based on substrate integrated suspended line technology," IEEE Transactions on Microwave Theory & Techniques, Vol. 65, No. 8, 2672-2680, 2017.
    doi:10.1109/TMTT.2017.2701374

    4. Yue, C. P. and S. S. Wong, "Physical modeling of spiral inductors on silicon," IEEE Transactions on Electron Devices, Vol. 47, No. 3, 560-568, 2002.
    doi:10.1109/16.824729

    5. Fang, X., R. Wu, and J. K. O. Sin, "Analytical modeling of AC resistance in thick coil integrated spiral inductors," IEEE Transactions on Electron Devices, Vol. 63, No. 2, 760-766, 2016.
    doi:10.1109/TED.2015.2507198

    6. Li, S., S. Smaili, and Y. Massoud, "Parasitic-aware design of integrated DC-DC converters with spiral inductors," IEEE Transactions on Very Large Scale Integration Systems, Vol. 23, No. 12, 3076-3084, 2015.
    doi:10.1109/TVLSI.2014.2387278

    7. Chuluunbaatar, Z., K. K. Adhikari, C. Wang, and N. Y. Kim, "Micro-fabricated bandpass filter using intertwined spiral inductor and interdigital capacitor," Electronics Letters, Vol. 50, No. 18, 1296-1297, 2014.
    doi:10.1049/el.2014.2040

    8. Lin, K. C., H. K. Chiou, and P. C. Wu, "2.4-GHz complementary metal oxide semiconductor power amplifier using high-quality factor wafer-level bondwire spiral inductor," IEEE Transactions on Components Packaging & Manufacturing Technology, Vol. 3, No. 8, 1286-1292, 2013.
    doi:10.1109/TCPMT.2012.2227260

    9. Xu, X., P. Li, M. Cai, and B. Han, "Design of novel high-Q-factor multipath stacked on-chip spiral inductors," IEEE Transactions on Electron Devices, Vol. 59, No. 8, 2011-2018, 2012.
    doi:10.1109/TED.2012.2197626

    10. Mohan, S. S., M. H. M. Del, S. P. Boyd, and T. H. Lee, "Simple accurate expressions for planar spiral inductances," IEEE J. Solid-State Circuits, Vol. 34, No. 10, 1419-1424, 1999.
    doi:10.1109/4.792620

    11. Ludwig, R. and G. Bogdanov, RF Circuit Design: Theory and Applications, R. Ludwig, G. Bogdanov, 410, Upper Saddle River, NJ, 2000.