Vol. 141
Latest Volume
All Volumes
PIER 180 [2024] PIER 179 [2024] PIER 178 [2023] PIER 177 [2023] PIER 176 [2023] PIER 175 [2022] PIER 174 [2022] PIER 173 [2022] PIER 172 [2021] PIER 171 [2021] PIER 170 [2021] PIER 169 [2020] PIER 168 [2020] PIER 167 [2020] PIER 166 [2019] PIER 165 [2019] PIER 164 [2019] PIER 163 [2018] PIER 162 [2018] PIER 161 [2018] PIER 160 [2017] PIER 159 [2017] PIER 158 [2017] PIER 157 [2016] PIER 156 [2016] PIER 155 [2016] PIER 154 [2015] PIER 153 [2015] PIER 152 [2015] PIER 151 [2015] PIER 150 [2015] PIER 149 [2014] PIER 148 [2014] PIER 147 [2014] PIER 146 [2014] PIER 145 [2014] PIER 144 [2014] PIER 143 [2013] PIER 142 [2013] PIER 141 [2013] PIER 140 [2013] PIER 139 [2013] PIER 138 [2013] PIER 137 [2013] PIER 136 [2013] PIER 135 [2013] PIER 134 [2013] PIER 133 [2013] PIER 132 [2012] PIER 131 [2012] PIER 130 [2012] PIER 129 [2012] PIER 128 [2012] PIER 127 [2012] PIER 126 [2012] PIER 125 [2012] PIER 124 [2012] PIER 123 [2012] PIER 122 [2012] PIER 121 [2011] PIER 120 [2011] PIER 119 [2011] PIER 118 [2011] PIER 117 [2011] PIER 116 [2011] PIER 115 [2011] PIER 114 [2011] PIER 113 [2011] PIER 112 [2011] PIER 111 [2011] PIER 110 [2010] PIER 109 [2010] PIER 108 [2010] PIER 107 [2010] PIER 106 [2010] PIER 105 [2010] PIER 104 [2010] PIER 103 [2010] PIER 102 [2010] PIER 101 [2010] PIER 100 [2010] PIER 99 [2009] PIER 98 [2009] PIER 97 [2009] PIER 96 [2009] PIER 95 [2009] PIER 94 [2009] PIER 93 [2009] PIER 92 [2009] PIER 91 [2009] PIER 90 [2009] PIER 89 [2009] PIER 88 [2008] PIER 87 [2008] PIER 86 [2008] PIER 85 [2008] PIER 84 [2008] PIER 83 [2008] PIER 82 [2008] PIER 81 [2008] PIER 80 [2008] PIER 79 [2008] PIER 78 [2008] PIER 77 [2007] PIER 76 [2007] PIER 75 [2007] PIER 74 [2007] PIER 73 [2007] PIER 72 [2007] PIER 71 [2007] PIER 70 [2007] PIER 69 [2007] PIER 68 [2007] PIER 67 [2007] PIER 66 [2006] PIER 65 [2006] PIER 64 [2006] PIER 63 [2006] PIER 62 [2006] PIER 61 [2006] PIER 60 [2006] PIER 59 [2006] PIER 58 [2006] PIER 57 [2006] PIER 56 [2006] PIER 55 [2005] PIER 54 [2005] PIER 53 [2005] PIER 52 [2005] PIER 51 [2005] PIER 50 [2005] PIER 49 [2004] PIER 48 [2004] PIER 47 [2004] PIER 46 [2004] PIER 45 [2004] PIER 44 [2004] PIER 43 [2003] PIER 42 [2003] PIER 41 [2003] PIER 40 [2003] PIER 39 [2003] PIER 38 [2002] PIER 37 [2002] PIER 36 [2002] PIER 35 [2002] PIER 34 [2001] PIER 33 [2001] PIER 32 [2001] PIER 31 [2001] PIER 30 [2001] PIER 29 [2000] PIER 28 [2000] PIER 27 [2000] PIER 26 [2000] PIER 25 [2000] PIER 24 [1999] PIER 23 [1999] PIER 22 [1999] PIER 21 [1999] PIER 20 [1998] PIER 19 [1998] PIER 18 [1998] PIER 17 [1997] PIER 16 [1997] PIER 15 [1997] PIER 14 [1996] PIER 13 [1996] PIER 12 [1996] PIER 11 [1995] PIER 10 [1995] PIER 09 [1994] PIER 08 [1994] PIER 07 [1993] PIER 06 [1992] PIER 05 [1991] PIER 04 [1991] PIER 03 [1990] PIER 02 [1990] PIER 01 [1989]
2013-07-12
Signal Integrity and Electromagnetic Broadband Packaging Model Extraction of Full Differential Bandpass Filter on IPD with BGA Packaging
By
Progress In Electromagnetics Research, Vol. 141, 201-217, 2013
Abstract
Since the system-level package was proposed, the electronics industry has increasingly attached importance to both directly relevant and related issues, and the scope of system-level package use has increased. Creating more complex system-level package structures, thereby leading to the design of overall electrical effects, requires more electromagnetic simulation resources, and therefore a great deal of time in the design process. The main purpose of this paper is to analyze the effects of system-level packaging, and to establish systems-in-package in accordance with electrical specifications. Using a segmented approach, this paper also builds an overall model for designers to predict electrical characteristics, thus shortening the product development schedule. In this paper, the transmission effects of a substrate are analyzed by changing the length of the substrate transmission line, with or without a thermal ground ball and ground ring. Previously established package IP are cascaded to establish the model of the package substrate, which verifies the feasibility of the package IP. We then analyze the characteristics of the interference between chips and package using an integrated passive device, and propose a complete package equivalent circuit model.
Citation
Sung-Mao Wu, Ren-Fang Hsu, and Po Hui Yu, "Signal Integrity and Electromagnetic Broadband Packaging Model Extraction of Full Differential Bandpass Filter on IPD with BGA Packaging," Progress In Electromagnetics Research, Vol. 141, 201-217, 2013.
doi:10.2528/PIER13040214
References

1. Kohyama, S., J. Matsunaga, and K. Hashimoto, "Directions in CMOS technology," International Electron Devices Meeting, Vol. 29, 151-154, 1983.

2. Chen, C.-C., C.-H.Wang, B.-J. Huang, H.-W. Tsao, and H.Wang, "A 24-GHz divide-by-4 injection-locked frequency divider in 0.13-μm CMOS technology ," IEEE Asian Solid-State Circuits Conference, ASSCC'07, 340-343, 2007.

3. Villegas, A., D. Vaquez, and A. Rueda, "A low power low voltage mixer for 2.4 GHz applications in CMOS-90nm technology," IEEE 13th International Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS), 44-47, 2010.
doi:10.1109/DDECS.2010.5491818

4. Siligaris, A., N. Deparis, R. Pilard, D. Gloria, C. Loyez, N. Rolland, L. Dussopt, J. Lanteri, R. Beck, and P. Vincent, "A 60 GHz UWB impulse radio transmitter with integrated antenna n CMOS 65nm SOI technology," IEEE 11th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF), 153-156, 2011.

5. Popp, J. D., B. Kormanyos, M. Adams, A. Hurtado, J. Braatz, C. Wolfhausen, and T. McKay, "Design of millimeter-wave mixed signal circuits in 45nm SOI CMOS," IEEE International SOI Conference (SOI), 1-2, 2010.

6. Tan, Y., H. Xu, M. A. El-tanani, S. Taylor, and H. Lakdawala, "A flip-chip-packaged 1.8V 28dBm class-AB power amplifier with shielded concentric transformers in 32nm SoC CMOS," IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 426-428, 2011.

7. Kuhn, K. J., "CMOS scaling for the 22nm node and beyond: Device physics and technology," International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), 1-2, 2011.

8. Eshraghian, K., "SoC emerging technologies," Proceedings of the IEEE, Vol. 94, No. 6, 1197-1213, 2006.
doi:10.1109/JPROC.2006.873615

9. Saleh, R., S. Wilton, S. Mirabbasi, A. Hu, M. Greenstreet, G. Lemieux, P. P. Pande, C. Grecu, and A. Ivanov, "System-on-chip: Reuse and integration," Proceedings of the IEEE, Vol. 94, No. 6, 1050-1069, 2006.
doi:10.1109/JPROC.2006.873611

10. Beelen-Hendrikx, C., "Trends in IC packaging," European Microelectronics and Packaging Conference, EMPC, 1-8, 2009.

11. Tummala, R. R., "Packaging: Past, present and future," 6th International Conference on Electronic Packaging Technology, 3-7, Mar. 2005.

12. Sham, M. X., Y. C. Chen, L. W. Leung, J. R. Lin, and T. Chung, "Challenges and opportunities in system-in-package (SiP) business," 7th International Conference on Electronic Packaging Technology, ICEPT'06, 1-5, 2006.

13. , , "Welcome to the IEEE International: 3D system integration conference (3DIC)," IEEE International 3D Systems Integration Conference (3DIC), 1-16, 2010.

14. Chen, M.-K., Y.-J. Huang, S.-J. Hou, Y.-H. Chen, C.-K. Yang, and S.-L. Fu, "Electrical modeling and circuit simulation for SI analysis of high-speed FC-BGA," International Conference on Electronic Materials and Packaging, EMAP 2006, 1-6, Dec. 11-14, 2006.

15. Jin, C.-Y., C.-H. Chou, D.-R. Li, and T.-Y. Chuang, "Improving signal integrity by optimal design of power/ground plane stack-up structure," 8th Electronics Packaging Technology Conference, EPTC'06, 853-859, Dec. 6-8, 2006.

16. Kaw, R., B. Hanna, and N. Devnani, "Comparison of electrical performance of enhanced BGA's," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, Vol. 21, No. 2, 164-170, May 1998.
doi:10.1109/96.673704

17. Yazdani, F., "Signal integrity characterization of microwave XFP ASIC BGA package realized on low-K liquid crystal polymer (LCP) substrate," IEEE Transactions on Advanced Packaging, Vol. 29, No. 2, 359-363, May 2006.
doi:10.1109/TADVP.2006.873132

18. Horng, T. S., A. Tseng, H. H. Huang, S. M. Wu, and J. J. Lee, "Comparison of advanced measurement and modeling techniques for electrical characterization of ball grid array packages," 48th IEEE Electronic Components & Technology Conference, 1464-1471, May 25-28, 1998.

19. Horng, T. S., S. M. Wu, J. Y. Li, C. T. Chiu, and C. P. Hung, "Electrical performance improvements on RFICs using bump chip carrier packages as compared to standard small outline packages," 50th Electronic Components & Technology Conference, 439-444, 2000.

20. Horng, T. S., S. M. Wu, and C. Shih, "Electrical modeling of RFIC packages up to 12 GHz," 49th Electronic Components and Technology Conference, 867-872, 1999.

21. Lion, L. L., M. Y. Muh, and A. Ferendeci, "Equivalent circuit parameter extraction of microstrip coupling lines using FDTD method," IEEE Antennas and Propagation Society International Symposium, Vol. 3, 1488-1491, Jul. 16-21, 2000.

22. Wu, S.-M., C.-T. Kuo, and C.-H. Chen, "Very compact full differential bandpass filter with transformer integrated using integrated passive device technology," Progress In Electromagnetics Research, Vol. 113, 251-267, 2011.

23. Wu, S.-M., C.-T. Kuo, P.-Y. Lyu, Y.-L. Shen, and C.-I. Chien, "Miniaturization design of full differential bandpass filter with coupled resonators using embedded passive device technology," Progress In Electromagnetics Research, Vol. 121, 365-379, 2011.
doi:10.2528/PIER11091404

24. Wai, L. L., K. M. Chua, A. C. W. Lu, M. Sun, and Y.-P. Zhang, "A compact package with integrated patch antenna for single-chip 60-GHz radios," Progress In Electromagnetics Research C, Vol. 20, 227-238, 2011.

25. Kaupp, H. R., "Characteristics of microstrip transmission lines," IEEE Transactions on Electronic Computers, Vol. 16, No. 2, 185-193, Apr. 1967.
doi:10.1109/PGEC.1967.264815

26. Nelatury, S. R., M. N. O. Sadiku, and V. K. Devabhaktuni, "CAD models for estimating the capacitance of a microstrip interconnect: Comparison and improvisation," PIERS Proceedings, 18-23, Prague, Czech Republic, Aug. 27-30, 2007.

27. Johnson, H. and M. Graham, High Speed Digital Design: A Handbook of Black Magic, Prentice Hall, 1993.