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Progress In Electromagnetics Research
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LTCC INTERCONNECT MODELING BY SUPPORT VECTOR REGRESSION

By L. Xia, R.-M. Xu, and B. Yan

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Abstract:
In this paper, we introduce a new method: support vector regression (SVR) method to modeling low temperature co-fired ceramic (LTCC) multilayer interconnect. SVR bases on structural risk minimization (SRM) principle, which leads to good generalization ability. A LTCC based stripline-to-stripline interconnect used as example to verify the proposed method. Experiment results show that the developed SVR model perform a good predictive ability in analyzing the electrical performance.

Citation: (See works that cites this article)
L. Xia, R.-M. Xu, and B. Yan, "LTCC Interconnect Modeling by Support Vector Regression," Progress In Electromagnetics Research, Vol. 69, 67-75, 2007.
doi:10.2528/PIER06120503
http://www.jpier.org/PIER/pier.php?paper=06120503

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