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Progress In Electromagnetics Research C
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3D LUMPED COMPONENTS AND MINIATURIZED BANDPASS FILTER IN AN ULTRA-THIN M-LCP FOR SOP APPLICATIONS

By E. Arabi and A. Shamim

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Abstract:
In this work, a library of 3D lumped components completely embedded in the thinnest, multilayer LCP (M-LCP) stack- up with four metallization layers and 100 μm of total thickness, is reported for the first time. A vertically and horizontally interdigitated capacitor, realized in this stack-up, provides higher self resonant frequency as compared to a similarly sized conventional parallel plate capacitor. Based on the above mentioned library, a miniaturized bandpass filter is presented for the GPS application. It utilizes mutually coupled inductors and is the smallest reported in the literature with a size of (0.035×0.028×0.00089)λg. Finally, the same filter realized in a competing ceramic technology (LTCC) is compared in performance with the ultra-thin M-LCP design. The M-LCP module presented in this work is inherently exible and offers great potential for wearable and conformal applications.

Citation:
E. Arabi and A. Shamim, "3D lumped components and miniaturized bandpass filter in an ultra-thin m-lcp for sop applications," Progress In Electromagnetics Research C, Vol. 44, 197-210, 2013.
doi:10.2528/PIERC13090903
http://www.jpier.org/pierc/pier.php?paper=13090903

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