Vol. 38

Front:[PDF file] Back:[PDF file]
Latest Volume
All Volumes
All Issues

An Overall LTCC Package Solution for X-Band Tile T/R Module

By Zhong Jun Yu, Zheng Xu, Yun-Kai Deng, and Zhi-Guang Zhang
Progress In Electromagnetics Research Letters, Vol. 38, 181-192, 2013


An overall Low-Temperature Co-fired Ceramics (LTCC) package solution for X-band T/R module has been presented in this paper. This tile type package contributes to a dramatic reduction in size and weight of the T/R module. Moreover, an obvious merit of ceramic housing is better consistency of Coefficient of Thermal Expansion (CTE), compared with the traditional combination of ceramic board and metal housing. The schematic diagram and 3-D structure of the T/R module have been presented and a novel vertical interconnection based on Ball Grid Array (BGA) has been proposed to connect vias in the lid and those in the stage of the main LTCC pan. The LTCC T/R module has been fabricated and measured. It is compact in size (20×20× 2.6 mm3) and has a weight of 3.5 g. The measured transmit output power is 33±1 dBm in the frequency range from 8.8 GHz to 10.4 GHz, and the measured receive gain and Noise Figure are 29-30.5 dB and 2.6-2.8 dB, respectively.


Zhong Jun Yu, Zheng Xu, Yun-Kai Deng, and Zhi-Guang Zhang, "An Overall LTCC Package Solution for X-Band Tile T/R Module," Progress In Electromagnetics Research Letters, Vol. 38, 181-192, 2013.


    1. Hauhe, M. S. and J. J. Wooldridge, "High density packaging of X-band active array modules," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 20, No. 3, 279-291, 1997.

    2. Jantunen, H., T. Kangasvieri, J. Vahakangas, and S. Leppavuori, "Design aspects of microwave components with LTCC technique," Journal of the European Ceramic Society, Vol. 23, No. 14, 2541-2548, 2003.

    3. Mancuso, Y., "Components and technologies for T/R modules," IEEE Aerospace and Electronic Systems Magazine, Vol. 25, No. 10, 39-43, 2010.

    4. Wang, Z., P. Li, R. M. Xu, and W. Lin, "A compact X-band receiver front-end module based on low temperature co-fired ceramic technology," Progress In Electromagnetics Research, Vol. 92, 167-180, 2009.

    5. Thorsell, M., M. Fagerlind, K. Andersson, N. Billstrom, and N. Rorsman, "An X-band AlGaN/GaN MMIC receiver front-end," EEE Microwave and Wireless Components Letters, Vol. 20, No. 1, 55-57, 2010.

    6. Donelli, M. and P. Febvre, "An inexpensive reconfigurable planar array for Wi-Fi applications," Progress In Electromagnetics Research C, Vol. 28, 71-81, 2012.

    7. Donelli, M., et al., "A planar electronically reconfigurable Wi-Fi band antenna based on a parasitic microstrip structure," IEEE Antennas and Wireless Propagation Letters, Vol. 6, 623-626, 2007.

    8. Donelli, M., "A rescue radar system for the detection of victims trapped under rubble based on the independent component analysis algorithm," Progress In Electromagnetics Research M, Vol. 19, 173-181, 2011.

    9. Rosenberger GmbH, "Mini SMP straight plug PCB full detent,", 2011, Available: http://rosenberger.de/ok/images/documents/db/18S10140ML5.pdf.

    10. Pillai, E. R., "Coax via-A technique to reduce crosstalk and enhance impedance match at vias in high-frequency multilayer packages verified by FDTD and MoM modeling," IEEE Trans. Microwave Theory and Tech., Vol. 45, No. 10, 1981-1985, 1997.

    11. Darwish, A., et al., "Analysis of three-dimensional embedded transmission lines (ETL's)," IEEE Microwave and Guided Wave Letters, Vol. 9, No. 11, 447-449, 1999.

    12. Machado, A. G., D. V. Martin, A. A. Lopez, and J. G. Menoyo, "Microstrip-to-stripline planar transitions on LTCC," IEEE MTT-S Microwave Workshop Series on Millimeter Wave Integration Technologies, 1-4, 2011.

    13. Kim, G., A. C. W. Lu, F. Wei, L. L. Wai, and J. Kim, "3D strip meander delay line structure for multilayer LTCC-based SIP applications," Electronic Components and Technology Conference, 2081-2085, 2008.

    14. Schreiner, M., H. Leier, W. Menzel, and H. P. Feldle, "Architecture and interconnect technologies for a novel conformal active phased array radar module," IEEE MTT-S Microwave Symposium Digest, 567-570, 2003.