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PIER PIER B PIER C PIER M PIER Letters PIER Photonics
2013-03-13
Study of the Coil Structure for Wireless Chip-to-Chip Communication Applications
By
Changhyun Lee,

    Dr. Changhyun Lee

    College of Information Technology

    Soongsil University

    Republic of Korea

    Homepage

Jonghoon Park,

    Mr. Jonghoon Park

    College of Information Technology

    Soongsil University

    Republic of Korea

    Homepage

Jinho Yoo,

    Dr. Jinho Yoo

    School of Electronic Engineering

    College of Information Technology, Soongsil University

    Republic of Korea

    Homepage

Changkun Park

    Dr. Changkun Park

    School of Electronic Engineering

    Soongsil University

    South Korea

    Homepage

Progress In Electromagnetics Research Letters, Vol. 38, 127-136, 2013
doi:10.2528/PIERL13022002 | Google Scholar

Abstract
In this work, we propose a merged coil structure for wireless chip-to-chip communication technology. Using the proposed coil structure, the chip size can be reduced, and the transmitted power can be improved by approximately 5 dB compared to typical coil structure. To verify the feasibility of the coil, an electromagnetic simulation and a schematic simulation are performed. The coil was implemented using 50-nm digital CMOS technology. From the experimental results, the feasibility was proved.
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Citation
Changhyun Lee, Jonghoon Park, Jinho Yoo, and Changkun Park, "Study of the Coil Structure for Wireless Chip-to-Chip Communication Applications," Progress In Electromagnetics Research Letters, Vol. 38, 127-136, 2013.
doi:10.2528/PIERL13022002
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