volume | PIER Journals

Abstract

In this work, we propose a merged coil structure for wireless chip-to-chip communication technology. Using the proposed coil structure, the chip size can be reduced, and the transmitted power can be improved by approximately 5 dB compared to typical coil structure. To verify the feasibility of the coil, an electromagnetic simulation and a schematic simulation are performed. The coil was implemented using 50-nm digital CMOS technology. From the experimental results, the feasibility was proved.

1. Lee, Y. C., H. T. Ghaffari, J. M. Segelken, "Internal thermal resistance of a multi-chip packaging design for vlsi based systems," IEEE Transactions on Components, Hybrids, and Manufacturing,, Vol. 12, No. 2, 163-169, Jun. 1989.
doi:10.1109/33.31420 Google Scholar

2. Lu, J.-Q., "3-D hyperintegration and packaging technologies for micronano systems," Proc. IEEE, Vol. 97, No. 1, 18-30, Jan. 2009.
doi:10.1109/JPROC.2008.2007458 Google Scholar

3. Xu, Z. and J.-Q. Lu, "Three-dimensional coaxial through-silicon-via (TSV) design," IEEE Electron. Device Letters, Vol. 33, No. 10, 1441-1443, Oct. 2012.
doi:10.1109/LED.2012.2207703 Google Scholar

4. Yang, J.-R., H.-C. Son, and Y.-J. Park, "A class-E power amplifier with coupling coils for a wireless power transfer system," Progress In Electromagnetics Research C, Vol. 35, 13-22, 2013. Google Scholar

5. Yuan, N., C. R. Liu, and X. Nie, "Electromagnetic field of arbitrarily oriented coil antennas in coplex underground environment," Progress In Electromagnetics Research B, Vol. 44, 261-282, 2012. Google Scholar

6. Babic, S. I., C. Akyel, Y. Ren, and W. Chen, "Magnetic force calculation between circular coils of rectangular cross section with parallel axes for superconducting magnet," Progress In Electromagnetics Research B, Vol. 37, 275-288, 2012.
doi:10.2528/PIERB11110508 Google Scholar

7. Park, C., J. Han, H. Kim, and S. Hong, "A 1.8-GHz CMOS power amplifier using a dual-primary transformer with improved efficiency in the low power region," IEEE Trans. on Microw. Theory and Tech., Vol. 56, No. 4, 782-792, Apr. 2008.
doi:10.1109/TMTT.2008.918152 Google Scholar

8. Danesh, M. and J. R. Long, "Differentially driven symmetric microstrip inductors," IEEE Trans. on Microw. Theory and Tech., Vol. 50, No. 1, 332-341, Jan. 2002.
doi:10.1109/22.981285 Google Scholar

9. Kang, B., H. Hwang, and C. Park, "Differential transformer using bonder-wires and patterns on a printed circuit board for RF circuit applications," Progress In Electromagnetics Research, Vol. 135, 363-371, 2013. Google Scholar

10. Park, C., D. H. Lee, J. Han, and S. Hong, "Tournament-shaped magnetically coupled power-combiner architecture for RF CMOS power amplifier," IEEE Trans. on Microw. Theory and Tech., Vol. 55, No. 10, 2034-2042, Oct. 2007.
doi:10.1109/TMTT.2007.905482 Google Scholar

11. Aoki, I., S. D. Kee, D. B. Rutledge, and A. Hajimiri, "Distributed active transformer --- A new power-combining and impedance-transformation technique," IEEE Trans. on Microw. Theory and Tech., Vol. 50, No. 1, 316-331, Jan. 2002.
doi:10.1109/22.981284 Google Scholar

12. Brandao Faria, J. A. M., "The effect of power-line sagged conductors on the evaluation of the differential voltage in a nearby circuit at ground level," Progress In Electromagnetics Research M, Vol. 24, 209-220, 2012. Google Scholar

Dr. Changhyun Lee

Mr. Jonghoon Park

Dr. Jinho Yoo

Dr. Changkun Park