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PIER PIER B PIER C PIER M PIER Letters PIER Photonics
2023-10-02
Modeling of Tsv-Based 3-D Heterogeneous Solenoid Inductor with High Inductance Value
By
Jinrong Su,

    Dr. Jinrong Su

    School of Physics and Electronic Engineering

    Shanxi University

    China

    Homepage

Haobo Wang,

    Dr. Haobo Wang

    School of Physics and Electronic Engineering

    Shanxi University

    China

    Homepage

Haipeng Dou,

    Dr. Haipeng Dou

    School of Information Engineering

    Shanxi Vocational University of Engineering Science and Technology

    China

    Homepage

Xinwei Chen

    Dr. Xinwei Chen

    College of Physics and Electronics Engineering

    Shanxi Univeristy

    China

    Homepage

Progress In Electromagnetics Research Letters, Vol. 112, 111-118, 2023
doi:10.2528/PIERL23071804 | Google Scholar

Abstract
In this letter, a novel 3-D heterogeneous solenoid inductor with high inductance value is proposed. By adding planar spiral structure at the ends of through-silicon vias (TSVs) of typical 3-D solenoid inductor, the heterogeneous solenoid is formed. The total inductance is increased by more than 41% compared with that of typical solenoid inductor of the same size. Additionally, an accurate analytical model of the inductor is established considering all the factors including angle and offset. Q3D simulation results verified the accuracy of the model, and the percentage error is less than 5.38%. This work provides an important reference for inductor designers to quickly estimate inductance value, configuration, and layout area.
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Citation
Jinrong Su, Haobo Wang, Haipeng Dou, and Xinwei Chen, "Modeling of Tsv-Based 3-D Heterogeneous Solenoid Inductor with High Inductance Value," Progress In Electromagnetics Research Letters, Vol. 112, 111-118, 2023.
doi:10.2528/PIERL23071804
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