Vol. 38

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2013-03-13

Study of the Coil Structure for Wireless Chip-to-Chip Communication Applications

By Changhyun Lee, Jonghoon Park, Jinho Yoo, and Changkun Park
Progress In Electromagnetics Research Letters, Vol. 38, 127-136, 2013
doi:10.2528/PIERL13022002

Abstract

In this work, we propose a merged coil structure for wireless chip-to-chip communication technology. Using the proposed coil structure, the chip size can be reduced, and the transmitted power can be improved by approximately 5 dB compared to typical coil structure. To verify the feasibility of the coil, an electromagnetic simulation and a schematic simulation are performed. The coil was implemented using 50-nm digital CMOS technology. From the experimental results, the feasibility was proved.

Citation


Changhyun Lee, Jonghoon Park, Jinho Yoo, and Changkun Park, "Study of the Coil Structure for Wireless Chip-to-Chip Communication Applications," Progress In Electromagnetics Research Letters, Vol. 38, 127-136, 2013.
doi:10.2528/PIERL13022002
http://www.jpier.org/PIERL/pier.php?paper=13022002

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