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PIER PIER B PIER C PIER M PIER Letters PIER Photonics
2014-07-28
High Frequency Electrical Characterization of 3D Signal/Ground through Silicon Vias
By
Steve Adamshick,

    Mr. Steve Adamshick

    SUNY College of Nanoscale Science and Engineering

    USA

    Homepage

Robert Carroll,

    Dr. Robert Carroll

    SUNY College of Nanoscale Science and Engineering

    USA

    Homepage

Megha Rao,

    Dr. Megha Rao

    SUNY College of Nanoscale Science and Engineering

    USA

    Homepage

Douglas La Tuplie,

    Dr. Douglas La Tuplie

    SUNY College of Nanoscale Science and Engineering

    USA

    Homepage

Seth Kruger,

    Dr. Seth Kruger

    SUNY College of Nanoscale Science and Engineering

    USA

    Homepage

John Burke,

    Dr. John Burke

    SUNY College of Nanoscale Science and Engineering

    USA

    Homepage

Michael Liehr

    Dr. Michael Liehr

    Western New England University

    USA

    Homepage

Progress In Electromagnetics Research Letters, Vol. 47, 71-75, 2014
doi:10.2528/PIERL14052704 | Google Scholar

Abstract
3D integration using through-silicon-vias (TSVs) is gaining considerable attention due to its superior packaging efficiency resulting in higher functionality, improved performance and a reduction in power consumption. In order to implement 3D chip designs with TSV technology, robust TSV electrical models are required. Specifically, due to the increase of signal speeds into the gigahertz (GHz) spectrum, a high frequency electrical characterization best describes TSV behavior. In this letter, 5x50 μm TSVs are manufactured using a via-mid integration scheme and characterized using S-Parameters up to 65 GHz. At 50 GHz, the measured attenuation constant is 0.35 dB/via with a time delay of 0.7 ps/via.
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Citation
Steve Adamshick, Robert Carroll, Megha Rao, Douglas La Tuplie, Seth Kruger, John Burke, and Michael Liehr, "High Frequency Electrical Characterization of 3D Signal/Ground through Silicon Vias," Progress In Electromagnetics Research Letters, Vol. 47, 71-75, 2014.
doi:10.2528/PIERL14052704
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