1. You, C. J., Z. N. Chen, X. W. Zhu, and K. Gong, "Single-layered SIWpost-loaded electric couplingenhanced structure and its filter applications," IEEE Trans. Microw. Theory Tech., Vol. 61, No. 1, 125-130, 2013.
doi:10.1109/TMTT.2012.2228667
2. Kong, F. F., W. Q. Ding, and Z. C. Hao, "A low cost W-band multilayer SIW filter," IEEE ICMMT, Vol. 1, 64-66, 2016.
3. Hao, Z. C., W. Q. Ding, and W. Hong, "Developing low-cost W-band SIW bandpass filters using the commercially available Printed-Circuit-Board technology," IEEE Trans. Microw. Theory Tech., Vol. 64, No. 6, 1775-1786, 2016.
doi:10.1109/TMTT.2016.2553029
4. Wu, L. S., X. L. Zhou, W. Y. Yin, C. T. Liu, L. Zhou, J. F. Mao, and H. L. Peng, "A new type of periodically loaded half-mode substrate integrated waveguide and its applications," IEEE Trans. Microw. Theory Tech., Vol. 58, No. 4, 882-893, 2010.
doi:10.1109/TMTT.2010.2042832
5. Moscato, S., C. Tomassoni, M. Bozzi, and L. Perregrini, "Quarter-Mode cavity filters in substrate integrated waveguide technology," IEEE Trans. Microw. Theory Tech., Vol. 64, No. 8, 2538-2547, 2016.
doi:10.1109/TMTT.2016.2577690
6. Li, P., H. Chu, and R. S. Chen, "Design of compact bandpass filters using quarter-mode and eighth-mode SIW cavities," IEEE Trans. Compon. Packag. Technol., Vol. 7, No. 6, 956-963, 2017.
doi:10.1109/TCPMT.2017.2677958
7. Azad, A. R. and A. Mohan, "Sixteenth-mode substrate integrated waveguide bandpass filter loaded with complementary split-ring resonator," Electron. Lett., Vol. 53, No. 8, 546-547, 2017.
doi:10.1049/el.2016.3620
8. Harrington, R. F., Time-Harmonic Electromagnetic Filed, McGraw-Hill, 1961.
9. Moscato, S., N. Delmonte, L. Silvestri, M. Bozzi, and L. Perregrini, "Half-mode versus folded SIW filters: Modeling and design," IEEE MTT-S Int. Conf. on Numerical Electromagnetic and Multiphysics Modeling and Optimization, 1-3, 2015.
10. Zhang, X. J., Y. X. Guo, and F. Wang, "Minimization of wideband LTCC bandpass filter using QMSIW and EMSIW cavities," IEEE MTT-S Int. Microw. Workshop Series on Advanced Materials and Processes for RF and THz Applications, 1-2, 2015.