1. Common Electrical I/O (CEI) - Electrical and Jitter Interoperability agreements for 6G+, 11G+bps, 25G+bps I/O and 56G+bps, OIF-CEI-04.0, 2017.
2. Fan, J., X. Ye, J. Kim, B. Archambeault, and A. Orlandi, "Signal integrity design for high-speed digital circuits: Progress and directions," IEEE Transactions on Electromagnetic Compatibility, Vol. 52, No. 2, 392-400, 2010.
doi:10.1109/TEMC.2010.2045381 Google Scholar
3. Cheng, Y.-S., K.-W. Chang, C.-T. Liu, and R.-B. Wu, "SI-aware vias and contact pads layouts and L-R equalization technique for 12 Gb/s backplane serial I/O interconnections," IEEE Transactions on Electromagnetic Compatibility, Vol. 55, No. 6, 1284-1292, 2013.
doi:10.1109/TEMC.2013.2266256 Google Scholar
4. Kumar, V., M. Vasa, S. Muthusamy, G. Anand, S. Kumar, and B. Mutnury, "Impact of via stub position on high speed serial links," 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 1-3, IEEE, 2018. Google Scholar
5. Seo, D., H. Lee, M. Park, and W. Nah, "Enhancement of differential signal integrity by employing a novel face via structure," IEEE Transactions on Electromagnetic Compatibility, Vol. 60, No. 1, 26-33, 2017.
doi:10.1109/TEMC.2017.2725943 Google Scholar
6. Zhang, B., et al. "A 28 Gb/s multistandard serial link transceiver for backplane applications in 28 nm CMOS," IEEE Journal of Solid-State Circuits, Vol. 50, No. 12, 3089-3100, 2015.
doi:10.1109/JSSC.2015.2475180 Google Scholar
7. Telian, D., S. Camerlo, M. Steinberger, B. Katz, and W. Katz, "Simulating large systems with thousands of serial links," DesignCon 2012 Conference, Santa Clara, CA, 2012. Google Scholar
8. Yong, Z. N., et al. "Main cause of resonance appeared around 7.5 GHz on the frequency response of S-parameters of PWB," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011. Google Scholar
9. Telian, D., S. Camerlo, K. Matta, M. Steinberger, B. Katz, and W. Katz, "Moving higher data rate serial links into production - Issues & solutions," DesignCon 2014 Conference, Santa Clara, CA, 2014. Google Scholar
10. IEEE Standard for Ethernet, Amendment 2: Physical Layer Specifications and Management Parameters for 100 Gb/s Operation Over Backplanes and Copper Cables, IEEE Std 802.3bj-2014, 2014.
11. Ya'acob, N., J. Johari, M. Zolkapli, A. L. Yusof, S. S. Sarnin, and N. F. Naim, "Link budget calculator system for satellite communication," 2017 International Conference on Electrical, Electronics and System Engineering (ICEESE), 115-119, IEEE, 2017.
doi:10.1109/ICEESE.2017.8298397 Google Scholar
12. Allred, R. J. and C. M. Furse, "Linearization of S-parameter cascading for analysis of multiple reflections," Applied Computational Electromagnetics Society Journal, Vol. 33, No. 12, 2018. Google Scholar
13. Frei, J., X.-D. Cai, and S. Muller, "Multiport S-parameter and T-parameter conversion with symmetry extension," IEEE Transactions on Microwave Theory and Techniques, Vol. 56, No. 11, 2493-2504, 2008.
doi:10.1109/TMTT.2008.2005873 Google Scholar
14. De Paulis, F., Y.-J. Zhang, and J. Fan, "Signal/power integrity analysis for multilayer printed circuit boards using cascaded S-parameters," IEEE Transactions on Electromagnetic Compatibility, Vol. 52, No. 4, 1008-1018, 2010.
doi:10.1109/TEMC.2010.2072784 Google Scholar
15. Reuschel, T., S. Müller, and C. Schuster, "Segmented physics-based modeling of multilayer printed circuit boards using stripline ports," IEEE Transactions on Electromagnetic Compatibility, Vol. 58, No. 1, 197-206, 2015.
doi:10.1109/TEMC.2015.2481001 Google Scholar
16. Mason, S. J., "Feedback theory: Further properties of signal flow graphs," Proceedings of the IRE, Vol. 44, No. 7, 920-926, 1956.
doi:10.1109/JRPROC.1956.275147 Google Scholar
17. Allred, R. J., "System and method for signal integrity waveform decomposition analysis,", U.S. Patent US20160103944A1, April 25, 2017. Google Scholar
18. Allred, R. J., B. Katz, and C. Furse, "Ripple analysis: Identify and quantify reflective interference through ISI decomposition," 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI), 2016. Google Scholar
19. Healey, A., C. Moore, R. Mellitz, A. Ran, and L. Ben-Artsi, "Proposal for a causal transmission line model," IEEE P802.3bj Task Force, March 2014. Google Scholar
20. Triverio, P., S. Grivet-Talocia, M. S. Nakhla, F. G. Canavero, and R. Achar, "Stability, causality, and passivity in electrical interconnect models," IEEE Transactions on Advanced Packaging, Vol. 30, No. 4, 795-808, 2007.
doi:10.1109/TADVP.2007.901567 Google Scholar
21. Lu, J. and F. Dawson, "EMC computer modeling and simulation techniques," 22nd Annual Review of Progress in Applied Computational Electromagneticss, 2006. Google Scholar
22. Eudes, T., B. Ravelo, and A. Louis, "Experimental validations of a simple PCB interconnect model for high-rate signal integrity," IEEE Transactions on Electromagnetic Compatibility, Vol. 54, No. 2, 397-404, 2011.
doi:10.1109/TEMC.2011.2165216 Google Scholar
23. Eudes, T., B. Ravelo, and A. Louis, "Transient response characterization of the high-speed interconnection RLCG-model for the signal integrity analysis," Progress In Electromagnetics Research, Vol. 112, 183-197, 2011.
doi:10.2528/PIER10111805 Google Scholar
24. Casper, B. K., M. Haycock, and R. Mooney, "An accurate and efficient analysis method for multi-Gb/s chip-to-chip signaling schemes," 2002 Symposium on VLSI Circuits. Digest of Technical Papers (Cat. No. 02CH37302), 54-57, IEEE, 2002.
doi:10.1109/VLSIC.2002.1015043 Google Scholar
25. Mathworks(r) Serdes Toolbox(tm) Reference (R2020a), retrived April 24, 2020 from https://www.mathworks.com/help/pdf_doc/serdes/serdes_ref.pdf.
26. Dsilva, H., et al. "Finding reflective insertion loss noise and reflectionless insertion loss," DesignCon 2020 Conference, Santa Clara, CA, 2020. Google Scholar
27. Liu, P., J. Zhang, and J. Fang, "Accurate characterization of lossy interconnects from TDR waveforms," 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, 187-190, 2013.
doi:10.1109/EPEPS.2013.6703495 Google Scholar
28. Schuster, C. and W. Fichtner, "Signal integrity analysis of interconnects using the FDTD method and a layer peeling technique," IEEE Transactions on Electromagnetic Compatibility, Vol. 42, No. 2, 229-233, 2000.
doi:10.1109/15.852417 Google Scholar
29. Allred, R., "Crosstalk decomposition and the triangle inequality property of peak distortion analysis," DesignCon 2010 Conference, 2010. Google Scholar
30. Wu, Y. and X. Zhang, "Analysis of channel crosstalk decomposition methods," 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), 575-579, 2019.
doi:10.1109/ISEMC.2019.8825229 Google Scholar