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PIER PIER B PIER C PIER M PIER Letters PIER Photonics
2021-06-07
Surface-Mount PIFA Using Ball Grid Array Packaging for 5G mmWave
By
Xi Wang,

    Dr. Xi Wang

    School of Microelectronics

    Tianjin University

    China

    Homepage

Xiubo Liu,

    Dr. Xiubo Liu

    School of Microelectronics

    Tianjin University

    China

    Homepage

Wei Zhang,

    Dr. Wei Zhang

    School of Electrical Information Engineering

    Tianjin University

    China

    Homepage

Dongning Hao,

    Dr. Dongning Hao

    School of Microelectronics

    Tianjin University

    China

    Homepage

Yanyan Liu

    Professor Yanyan Liu

    Nankai University

    China

    Homepage

Progress In Electromagnetics Research Letters, Vol. 98, 55-60, 2021
doi:10.2528/PIERL21050203 | Google Scholar

Abstract
In this letter, a surface-mount planar inverted-F antenna (PIFA) is proposed for the 5G mmWave system using ball grid array packaging (BGA). To meet the requirement of cost-effectiveness, the proposed antenna element is designed on a single FR4 layer to achieve low cost. To achieve a compact size, the BGA packaging is used on the proposed antenna element. Finally, the size of the antenna prototype is only 4.5 mm × 4.5 mm × 1.3 mm. Besides, the surface-mount feature allows the proposed antenna to be integrated with other devices in the same system package. The simulation and measurement results are discussed in detail. The measurement results show that the impedance bandwidth of - 10 dB is 15.3 % (24.7-29.6 GHz), and the peak gain is 5.85 dBi at 28 GHz. The proposed PIFA can be used in the 5G NR bands N257 (26.5-29.5 GHz), N258 (24.25-27.5 GHz), and N261 (27.5-28.35 GHz).
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Citation
Xi Wang, Xiubo Liu, Wei Zhang, Dongning Hao, and Yanyan Liu, "Surface-Mount PIFA Using Ball Grid Array Packaging for 5G mmWave ," Progress In Electromagnetics Research Letters, Vol. 98, 55-60, 2021.
doi:10.2528/PIERL21050203
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