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PIER PIER B PIER C PIER M PIER Letters PIER Photonics
2009-12-10
Thermal Noise Analysis of the Resistive Vee Dipole
By
S. Park,

    Dr. S. Park

    Samsung Electronics Corporation

    Korea

    Homepage

Kangwook Kim

    Prof. Kangwook Kim

    School of Information and Mechatronics

    Gwangju Institute of Science and Technology

    South Korea

    Homepage

Progress In Electromagnetics Research Letters, Vol. 13, 21-28, 2010
doi:10.2528/PIERL09082801 | Google Scholar

Abstract
The thermal noise of the resistive vee dipole (RVD) has been analyzed using a numerical model based on the method of moments. The RVD analyzed in this paper has curved arms and is loaded with surface-mount chip resistors, which approximate a modified Wu-King profile. The total noise power delivered to a 200­­­­ Ω feed line and the contribution of individual resistors to the total noise power are presented. The results show that the noise temperature of the RVD is very high and the resistors close to the drive point contribute more to the total noise power than do the resistors close to the open ends of the antenna arms.
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Citation
S. Park, and Kangwook Kim, "Thermal Noise Analysis of the Resistive Vee Dipole," Progress In Electromagnetics Research Letters, Vol. 13, 21-28, 2010.
doi:10.2528/PIERL09082801
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