volume | PIER Journals

Abstract

A novel dual-side mushroom ground plane (DMGP) structure is proposed for the noise suppression in high-speed multilayer printed circuit boards (PCBs). The proposed method is localized suppression technique where a dual-side mushroom structure is placed below the noise-sensitive device. In multilayer PCBs with DMGP, noise between two ports with large or small ports spacing can be minimized effectively, which is flexible for the layout of mixed-signal system. Wideband noise suppression is achieved for the fabricated boards even though the port spacing is only 3.5 mm.

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Dr. Jianjie Li

Dr. Jun-Fa Mao

Dr. Siwei Ren

Dr. Hao-Ran Zhu