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PIER PIER B PIER C PIER M PIER Letters PIER Photonics
2013-03-20
An Overall LTCC Package Solution for X-Band Tile T/R Module
By
Zhong Jun Yu,

    Dr. Zhong Jun Yu

    Institute of Electronics, Chinese Academy of Sciences

    China

    Homepage

Zheng Xu,

    Dr. Zheng Xu

    Institute of Electronics, Chinese Academy of Sciences

    China

    Homepage

Yun-Kai Deng,

    Dr. Yun-Kai Deng

    Department of Space Microwave Remote Sensing

    Institute of Electronics, Chinese Academy of Sciences

    China

    Homepage

Zhi-Guang Zhang

    Dr. Zhi-Guang Zhang

    Institute of Electronics, Chinese Academy of Sciences

    China

    Homepage

Progress In Electromagnetics Research Letters, Vol. 38, 181-192, 2013
doi:10.2528/PIERL13011009 | Google Scholar

Abstract
An overall Low-Temperature Co-fired Ceramics (LTCC) package solution for X-band T/R module has been presented in this paper. This tile type package contributes to a dramatic reduction in size and weight of the T/R module. Moreover, an obvious merit of ceramic housing is better consistency of Coefficient of Thermal Expansion (CTE), compared with the traditional combination of ceramic board and metal housing. The schematic diagram and 3-D structure of the T/R module have been presented and a novel vertical interconnection based on Ball Grid Array (BGA) has been proposed to connect vias in the lid and those in the stage of the main LTCC pan. The LTCC T/R module has been fabricated and measured. It is compact in size (20×20× 2.6 mm3) and has a weight of 3.5 g. The measured transmit output power is 33±1 dBm in the frequency range from 8.8 GHz to 10.4 GHz, and the measured receive gain and Noise Figure are 29-30.5 dB and 2.6-2.8 dB, respectively.
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Citation
Zhong Jun Yu, Zheng Xu, Yun-Kai Deng, and Zhi-Guang Zhang, "An Overall LTCC Package Solution for X-Band Tile T/R Module," Progress In Electromagnetics Research Letters, Vol. 38, 181-192, 2013.
doi:10.2528/PIERL13011009
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