volume | PIER Journals

Abstract

In this paper we present an approach to reduce the cavity resonant edge effects in printed circuit boards (PCBs) and semiconductor packages. Power supply noise, in the form of fast changing currents (di/dt), traverses the power-return paths of PCBs and semiconductor packages using power vias. The cavity effects produce considerable level of noise along the edges of PCB and integrated circuit (IC) package power planes due to signal coupling between vias and reflection from PCB edges with transient currents. The cavity effects also amplify the electromagnetic radiation from PCB edges, which are major sources of EMI/EMC problems in electronic devices. By using absorbing material and decoupling capacitors (de-caps) on power distribution networks (PDNs), we observe considerable mitigation in impedance noise, signal noise and electromagnetic interference/compatibility (EMI/EMC) issues caused by the cavity effects. In particular, simulation results show notable reduction of upper peak (anti-resonant) impedance noise and reduction in radiated emissions by as much as 20 dB. This article presents a comparative case-study using various models (Section 3) and report on their effectiveness to reduce the cavity effects. The models are listed as (1) "Original" model, (2) "Absorbing material along the edge" model, (3) "MURATA based De-cap only" model and (4) "Absorbing material along the edge w/ De-cap" model. The used capacitance ranges between 0.1 μF and 22 μF. The ESR and ESL range between 2 mOhm-20 mOhm and 238 pH-368 pH, respectively. Conclusively, we learn by adding absorbing material along the PCB edges with a few decoupling capacitors. The PDN impedance noise is improved, and EMI issues in PCBs and semiconductor packages suppress the cavity effects.

1. Swaminathan, M. and E. Engin, Power Integrity Modeling and Design for Semiconductors and Systems, Pearson Education, 2007.

2. Archambeault, B., C. Brench, and S. Connor, "Review of printed-circuit-board level EMI/EMC issues and tools," IEEE Transactions on Electromagnetic Capability, Vol. 52, No. 2, 455-461, May 2010. Google Scholar

3. Wang, X.-X. and D.-L. Su, "The influence of power-ground resonance to via’s SSN noise coupling in multilayer package and three mitigating ways," Proc. IEEE Conf. Electron Mater. Packag. (EMAP), 1-5, Dec. 11–14, 2006. Google Scholar

4. Pak, J. S., H. Kim, J. Lee, and J. Kim, "Modeling and measurement of radiated field emission from power-ground plane cavity edge excited by through-hole signal via based on balanced TLM and via coupling model," IEEE Trans. Adv. Packag., Vol. 30, No. 1, 73-85, Feb. 2007. Google Scholar

5. Ding, T.-H., Y.-S. Li, D.-C. Jiang, Y.-Z. Qu, and X. Yan, "Estimation method for simultaneous switching noise in power delivery network for high-speed digital system design," Progress In Electromagnetics Research, Vol. 125, 79-95, 2012. Google Scholar

6. Tsang, L. and S. Huang, "Broadband Green's function with low wavenumber extraction for arbitrary shaped waveguide and applications to modeling of vias in finite power/ground plane," Progress In Electromagnetics Research, Vol. 152, 105-125, 2015. Google Scholar

7. Huang, S. and L. Tsang, "Fast electromagnetic analysis of emissions from printed circuit boards using broadband Green's function method," IEEE Transactions on Electromagnetic Capability, Vol. 58, No. 5, 1642-1652, 2016. Google Scholar

8. Huang, S. and L. Tsang, "Fast electromagnetic modeling of traces connecting vias in printed circuit boards using broadband Green's function method," IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, in press. Google Scholar

9. Huang, S. and J. DeLaCruz, "Improvements of system-in-package integration and electrical performance using BVA wire bonding," IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, in press. Google Scholar

10. Huang, S. and B. Lee, "Novel broadband equalizer optimization technique for high-speed digital system designs," Progress In Electromagnetics Research B, Vol. 65, No. 1, 143-155, 2016. Google Scholar

11. Huang, S. and B. Lee, "New de-embedding method with look-up table for characterization of high-speed interconnects," Progress In Electromagnetics Research B, Vol. 65, No. 1, 129-141, 2016. Google Scholar

12. Ravelo, B. and O. Maurice, "Kron-Branin modeling of Y-Y-tree interconnects for the PCB signal integrity analysis," IEEE Transactions on Electromagnetic Compatibility, Vol. 59, No. 2, 411-419, Apr. 2017. Google Scholar

13. Ravelo, B., "Behavioral model of symmetrical multi-level T-tree interconnects," Progress In Electromagnetics Research B, Vol. 41, 23-50, 2012. Google Scholar

14. Perini, J. and L. S. Cohen, "Design of broad-band radar-absorbing materials for large angles of incidence," IEEE Transactions on Electromagnetic Capability, Vol. 35, No. 2, 223-230, May 1993. Google Scholar

15. Vinoy, K. J. and R. M. Jha, Radar Absorbing Materials — From Theory to Design and Characterization, Kluwer Academic Publishers, 1996.

16. Hatakeyama, K. and H. Togawa, "Incombustible electromagnetic wave absorber made of nonwoven ceramic fibers," IEEE Transactions on Electromagnetic Capability, Vol. 40, No. 1, 27-32, Feb. 1998. Google Scholar

17. Petrov, V. M. and V. V. Gagulin, "Microwave absorbing materials," Inorganic Materials, Vol. 37, No. 2, 93-98, 2001. Google Scholar

18. Neo, C. P. and V. K. Varadan, "Optimization of carbon fiber composite for microwave absorber," IEEE Transactions on Electromagnetic Capability, Vol. 46, No. 1, 102-106, Feb. 2004. Google Scholar

19. Dixon, P., "Cavity-resonance dampening," IEEE Microw. Mag., Vol. 6, No. 2, 74-84, 2005. Google Scholar

20. Zhang, C., H. Li, and M. Lu, "Development of stealth technique compounded radar absorbing material and FSS," Materials Review, Vol. 21, No. 1, 118-120, 2007. Google Scholar

21. Ford, K. L. and B. Chambers, "Application of impedance loading to geometric transition radar absorbent material," IEEE Transactions on Electromagnetic Capability, Vol. 49, No. 2, 339-345, May 2007. Google Scholar

22. Xu, Z., W. Lin, and L. Kong, "Controllable absorbing structure of metamaterial at microwave," Progress In Electromagnetics Research, Vol. 69, 117-125, 2007. Google Scholar

23. Oraizi, H., A. Abdolali, and N. Vaseghi, "Application of double zero metamaterials as radar absorbing materials for the reduction of radar cross section," Progress In Electromagnetics Research, Vol. 101, 323-337, 2010. Google Scholar

24. Kim, J.-B. and J.-H. Byun, "Salisbury Sn absorbers of dielectric lossy sheets of carbon nanocomposite laminates," IEEE Transactions on Electromagnetic Capability, Vol. 54, No. 1, 37-42, Feb. 2012. Google Scholar

25. Cheng, E. M., M. F. B. A. Malek, M. Ahmed, K. Y. You, K. Y. Lee, and H. Nornikman, "The use of dielectric mixture equations to analyze the dielectric properties of a mixture of rubber tire dust and rice husks in a microwave absorber," Progress In Electromagnetics Research, Vol. 129, 559-578, 2012. Google Scholar

26. Koledintseva, M. Y., A. G. Razmadze, A. Y. Gafarov, V. V. Khilkevich, J. L. Drewniak, and T. Tsutaoka, "Attenuation in extended structures coated with thin magneto-dielectric absorber layer," Progress In Electromagnetics Research, Vol. 118, 441-459, 2011. Google Scholar

27. Kollatou, T. M., A. I. Dimitriadis, S. Assimonis, N. V. Kantartzis, and C. S. Antonopoulos, "A family of ultra-thin, polarization-insensitive, multi-band, highly absorbing metamaterial structures," Progress In Electromagnetics Research, Vol. 136, 579-594, 2013. Google Scholar

28. Araneo, R., G. Lovat, and S. Celozzi, "Compact electromagnetic absorbers for frequencies below 1 GHz," Progress In Electromagnetics Research, Vol. 143, 67-86, 2013. Google Scholar

29. Zahid, L., M. F. B. A. Malek, H. Nornikman, N. A. MohdAffendi, A. Ali, N. Hussin, B. H. Ahmad, and M. Z. A. Abdul Aziz, "Development of pyramidal microwave absorber using sugar cane bagasse (SCB)," Progress In Electromagnetics Research, Vol. 137, 687-702, 2013. Google Scholar

30. Zhang, F., L. Yang, Y. Jin, and S. He, "Turn a highly-reflective metal into an omnidirectional broadband absorber by coating a purely-dielectric thin layer of grating," Progress In Electromagnetics Research, Vol. 134, 95-109, 2013. Google Scholar

31. Wang, G.-D., J.-F. Chen, X. Hu, Z.-Q. Chen, and M. Liu, "Polarization-insensitive triple-band microwave metamaterial absorber based on rotated square rings," Progress In Electromagnetics Research, Vol. 145, 175-183, 2014. Google Scholar

32. Lin, J., H. Zhang, P. Li, X. Yin, and G. Zeng, "The electromagnetic shielding effectiveness of a low-cost and transparent stainless steel fiber/silicone resin composite," IEEE Transactions on Electromagnetic Capability, Vol. 56, No. 2, 328-334, Apr. 2014. Google Scholar

33. Dincer, F., O. Akgol, M. Karaaslan, E. Unal, and C. Sabah, "Polarization angle independent perfect metamaterial absorbers for solar cell applications in the microwave, infrared, and visible regime," Progress In Electromagnetics Research, Vol. 144, 93-101, 2014. Google Scholar

34. Huang, S. and J. J. Abbott, Reflected signal absorption in interconnect, US patent No. 14/303396, 2014.

35. Huang, S., K. Xiao, B. Lee, B. Wu, and X. Ye, Absorbing termination in an interconnect, US patent No. 14/539597, 2014.

36. Huang, S., K. Xiao, and B. Lee, "Electromagnetic wave absorption technology for stub effects mitigation," DesignCon, Santa Clara, CA, 2016. Google Scholar

37. Huang, S., X. Ye, N. Kang, B. Lee, and K. Xiao, "Suppression of couplings in high-speed interconnects using absorbing materials," IEEE Transactions on Electromagnetic Compatibility, Vol. 58, No. 5, 1432-1439, Oct. 2016. Google Scholar

38. Huang, S., K. Xiao, B. Lee, and X. Ye, "Stub effect mitigations using absorbing materials," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 6, No. 8, 1233-1244, 2016. Google Scholar

39. Li, J., X. Li, S. Toor, H. Fan, A. U. Bhobe, J. Fan, and J. L. Drewniak, "EMI coupling paths and mitigation in a board-to-board connector," IEEE Transactions on Electromagnetic Capability, Vol. 57, No. 4, 771-779, Aug. 2015. Google Scholar

40. Huang, S., G. Charles, K. Xiao, B. Lee, G. Ouyang, and H. Zhang, "Suppression of cavity resonant edge effects and PDN impedance using absorbing material," 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity, 12-16, Santa Clara, CA, 2015. Google Scholar

41. Murata capacitor product online data base, , http://www.murata.com/en-us/tool/download/ simsurfing, 2016.

Dr. Shaowu Huang

Dr. Gary Charles

Dr. Kai Xiao

Dr. Beomtaek Lee