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PIER PIER B PIER C PIER M PIER Letters PIER Photonics
2020-12-09
A New Equivalent Circuit Scheme for Grounded Back-to-Back GCPW-MS-GCPW Transitions Fabricated on a Thin Low-k Substrate
By
Pierre-Vincent Dugue,

    Dr. Pierre-Vincent Dugue

    University Brittany Loire, University of Nantes, Institute of Electronics and Telecommunications of Rennes, UMR CNRS 6164

    France

    Homepage

Mohammed El-Gibari,

    Dr. Mohammed El-Gibari

    Faculte des Sciences et Techniques, Institut d'Electronique et de Telecommunications de Rennes

    Lunam Universite, Universite de Nantes

    France

    Homepage

Mathieu Halbwax,

    Dr. Mathieu Halbwax

    Institute of Electronics, Microelectronics and Nanotechnologies, UMR CNRS 8520

    University of Lille

    France

    Homepage

Stephane Ginestar,

    Dr. Stephane Ginestar

    Faculte des Sciences et Techniques, Institut d'Electronique et de Telecommunications de Rennes

    Lunam Universite, Universite de Nantes

    France

    Homepage

Vanessa Avramovic,

    Dr. Vanessa Avramovic

    Institute of Electronics, Microelectronics and Nanotechnologies, UMR CNRS 8520

    University of Lille

    France

    Homepage

Jean-Pierre Vilcot,

    Dr. Jean-Pierre Vilcot

    Institute of Electronics, Microelectronics and Nanotechnologies, UMR CNRS 8520, University of Lille

    France

    Homepage

Hongwu Li

    Dr. Hongwu Li

    Faculte des Sciences et Techniques, Institut d'Electronique et de Telecommunications de Rennes

    Lunam Universite, Universite de Nantes

    France

    Homepage

Progress In Electromagnetics Research Letters, Vol. 95, 33-42, 2021
doi:10.2528/PIERL20093003 | Google Scholar

Abstract
We hereby present a new equivalent circuit model including both lumped and distributed elements for GCPW-MS transitions (GCPW for Grounded Coplanar Waveguide and MS for Microstrip). In order validating the modelling results, such transitions have been fabricated on a 20 µm-thick BCB (Benzocyclobutene resin) substrate using grounding pads including via-holes of different diameters. The study focuses on the impact of the via-hole design on the performance of the transition and more specifically on its bandwidth. The transitions were made using a simple technological process based on photosensitive polymer. ADS simulation data of the new equivalent circuit model were in very good agreement with measured S-parameters. Both theoretical and experimental results show that the bandwidth of such a transition can reach up to 100 GHz bandwidth using via-holes of 900 µm diameter.
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Citation
Pierre-Vincent Dugue, Mohammed El-Gibari, Mathieu Halbwax, Stephane Ginestar, Vanessa Avramovic, Jean-Pierre Vilcot, and Hongwu Li, "A New Equivalent Circuit Scheme for Grounded Back-to-Back GCPW-MS-GCPW Transitions Fabricated on a Thin Low-k Substrate," Progress In Electromagnetics Research Letters, Vol. 95, 33-42, 2021.
doi:10.2528/PIERL20093003
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