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PIER PIER B PIER C PIER M PIER Letters PIER Photonics
2021-07-20
Improving Electromagnetic Compatibility Performance of Narrowband-IoT SiP Module
By
Haiyan Sun,

    Dr. Haiyan Sun

    Nantong University

    China

    Homepage

Ting Zhou,

    Dr. Ting Zhou

    School of Information Science and Technology

    Nantong University

    China

    Homepage

Shoukun Huang,

    Dr. Shoukun Huang

    School of Information Science and Technology

    Nantong University

    China

    Homepage

Jicong Zhao,

    Dr. Jicong Zhao

    Nantong University

    China

    Homepage

Zhilong Zhang,

    Dr. Zhilong Zhang

    Tongfu Microelectronics Co., Ltd

    China

    Homepage

Xiaoyong Miao

    Dr. Xiaoyong Miao

    Tongfu Microelectronics Co. Ltd

    China

    Homepage

Progress In Electromagnetics Research M, Vol. 103, 185-196, 2021
doi:10.2528/PIERM21040502 | Google Scholar

Abstract
A package-board co-design method was applied for a Narrowband Internet-of-Things (NB-IoT) SiP module. The electromagnetic interference (EMI) generated by the module was studied by improving the transmission quality of radio frequency (RF) signal. The SiP models of the initial design and the optimized design were simulated separately to show that the optimized design significantly increased effective transmission power of the RF signal and suppressed near-field electromagnetic radiation intensity to a certain extent. In addition, the optimized design model was verified by measurement. The measured results show good agreement with the simulated ones and demonstrate that the package-board co-design method can improve the electromagnetic compatibility (EMC) of NB-IoT applications.
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Citation
Haiyan Sun, Ting Zhou, Shoukun Huang, Jicong Zhao, Zhilong Zhang, and Xiaoyong Miao, "Improving Electromagnetic Compatibility Performance of Narrowband-IoT SiP Module," Progress In Electromagnetics Research M, Vol. 103, 185-196, 2021.
doi:10.2528/PIERM21040502
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