1. Cunha, T. R., H. M. Teixeira, J. C. Pedro, et al. "Validation by measurements of an IC modeling approach for SiP applications," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 1, No. 8, 1214-1225, Aug. 2011.
doi:10.1109/TCPMT.2011.2158313        Google Scholar

2. Yoon, S. W., S. Y. L. Lim, A. G. K. Viswanath, S. Thew, T. C. Chai, and V. Kripesh, "Reliability of a silicon stacked module for 3-D SiP microsystem," IEEE Transactions on Advanced Packaging, Vol. 31, No. 1, 127-134, Feb. 2008.
doi:10.1109/TADVP.2007.914971        Google Scholar

3. Liu, L. T., M. Y. Yu, Y. Z. Ye, et al. "Design and simulation of SIP for RF system," 2005 6th International Conference on Electronic Packaging Technology, 102-104, 2005.        Google Scholar

4. Kripesh, V., S. W. Yoon, V. P. Ganesh, et al. "Three-dimensional system-in-package using stacked silicon platform technology," IEEE Transactions on Advanced Packaging, Vol. 28, No. 3, 377-386, Aug. 2005.
doi:10.1109/TADVP.2005.852895        Google Scholar

5. Kelander, I., M. Uusimaki, and A. N. Arslan, "EMC analysis on stacked packages," 2006 17th International Zurich Symposium on Electromagnetic Compatibility, 602-605, 2006.
doi:10.1109/EMCZUR.2006.215006        Google Scholar

6. Jiang, F., M. Li, and L. Gao, "Research on conformal EMI shielding Cu/Ni layers on package," 2014 15th International Conference on Electronic Packaging Technology, 227-230, 2014.
doi:10.1109/ICEPT.2014.6922642        Google Scholar

7. Tsai, M., R. Chiu, D. Huang, et al. "Innovative packaging solutions of 3D double side molding with system in package for IoT and 5G application," 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 700-706, 2019.
doi:10.1109/ECTC.2019.00111        Google Scholar

8. Liao, K. H., S. C. Hsien, H. H. Wen, et al. "Novel EMI shielding methodology on highly integration SiP module," 2012 2nd IEEE CPMT Symposium Japan, 1-4, 2012.        Google Scholar

9. Hwang, L. T. and T. S. J. Horng, "State-of-the-art IC packages, modules, and substrates," 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility, 111-137, IEEE, 2017.        Google Scholar

10. Huang, C., C. Hsiao, C. Wang, et al. "Conformal shielding investigation for SiP modules," 2010 IEEE Electrical Design of Advanced Package & Systems Symposium, 1-4, 2010.        Google Scholar

11. Karim, N., J. K. Mao, and J. Fan, "Improving electromagnetic compatibility performance of packages and SiP modules using a conformal shielding solution," 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility, 56-59, 2010.
doi:10.1109/APEMC.2010.5475724        Google Scholar

12. Fee, T. M., L. S. Kah, G. S. Lock, et al. "Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance," 2014 IEEE International Conference on Semiconductor Electronics (ICSE2014), 313-316, 2014.
doi:10.1109/SMELEC.2014.6920860        Google Scholar

13. Wang, L. B., K. Y. See, J. W. Zhang, et al. "Ultrathin and flexible screen-printed metasurfaces for EMI shielding applications," IEEE Transactions on Electromagnetic Compatibility, Vol. 53, No. 3, 700-705, Aug. 2011.
doi:10.1109/TEMC.2011.2159509        Google Scholar

14. He, Y., J. Li, G. Tian, et al. "Study on a conformal shielding structure with conductive adhesive coated on molding compound in 3-D packages," IEEE Transactions on Electromagnetic Compatibility, Vol. 58, No. 2, 442-447, Apr. 2016.
doi:10.1109/TEMC.2015.2503729        Google Scholar

15. Hoang, J. V., R. Darveaux, T. Lobianco, et al. "Breakthrough packaging level shielding techniques and EMI effectiveness modeling and characterization," 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1290-1296, 2016.
doi:10.1109/ECTC.2016.300        Google Scholar

16. Wu, T. L., W. S. Jou, S. G. Dai, et al. "Effective electromagnetic shielding of plastic packaging in low-cost optical transceiver modules," Journal of Lightwave Technology, Vol. 21, No. 6, 1536-1543, Jun. 2003.
doi:10.1109/JLT.2003.810087        Google Scholar

17. Tai, M. F., S. L. Kok, and K. Mukai, "EMI shielding performance by metal plating on mold compound," 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference, 1-4, 2016.        Google Scholar

18. Jin, L., H. Y. Zhang, L. Ping, et al. "The electromagnetic shielding effectiveness of a low-cost and transparent stainless steel fiber/silicone resin composite," IEEE Transactions on Electromagnetic Compatibility, Vol. 56, No. 2, 328-334, Apr. 2014.
doi:10.1109/TEMC.2013.2280140        Google Scholar

19. Rathi, V. and V. Panwar, "Electromagnetic interference shielding analysis of conducting composites in near- and far-field region," IEEE Transactions on Electromagnetic Compatibility, Vol. 60, No. 6, 1795-1801, Dec. 2018.
doi:10.1109/TEMC.2017.2780883        Google Scholar

20. Hsiao, C. Y., C. H. Huang, C. D. Wang, et al. "Mold-based compartment shielding to mitigate the intra-system coupled noise on SiP modules," 2011 IEEE International Symposium on Electromagnetic Compatibility, 341-344, 2011.
doi:10.1109/ISEMC.2011.6038333        Google Scholar

21. Sitaraman, S., J. Min, M. R. Pulugurtha, et al. "Modeling, design and demonstration of integrated electromagnetic shielding for miniaturized RF SOP glass packages," 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1956-1960, 2015.
doi:10.1109/ECTC.2015.7159869        Google Scholar

22. Huang, S. and J. DeLaCruz, "Improvements of system-in-package integration and electrical performance using BVA wire bonding," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 7, No. 7, 1020-1034, Jul. 2017.
doi:10.1109/TCPMT.2017.2657380        Google Scholar

23. Huang, S. and J. DeLaCruz, "Techniques for improving system-in-package integration and electrical performance," 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 129-134, 2017.
doi:10.1109/ISEMC.2017.8078008        Google Scholar

24. Huang, S., X. Ye, N. Kang, et al. "Suppression of couplings in high-speed interconnects using absorbing materials," IEEE Transactions on Electromagnetic Compatibility, Vol. 58, No. 5, 1432-1439, Oct. 2016.
doi:10.1109/TEMC.2016.2582867        Google Scholar

25. Pulici, P., G. P. Vanalli, M. A. Dellutri, et al. "Signal integrity flow for system-in-package and package-on-package devices," Proceedings of the IEEE, Vol. 97, No. 1, 84-95, Jan. 2009.
doi:10.1109/JPROC.2008.2007469        Google Scholar

26. Jandhyala, V., D. Gope, S. Chakraborty, et al. "Toward building full-system EMI verification and early design flows through full-wave electromagnetic simulation," International Journal of RF and Microwave Computer-Aided Engineering, Vol. 22, No. 1, 104-115, Jan. 2012.
doi:10.1002/mmce.20589        Google Scholar

27. Song, T., C. Liu, Y. Pen, et al. "Full-chip signal integrity analysis and optimization of 3-D ICs," IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Vol. 24, No. 5, 1636-1648, May 2016.
doi:10.1109/TVLSI.2015.2471098        Google Scholar

28. Oikawa, R., "Package substrate built-in three-dimensional distributed matching circuit for high-speed SerDes applications," 2008 58th Electronic Components and Technology Conference, 676-682, 2008.
doi:10.1109/ECTC.2008.4550045        Google Scholar

29. Seo, D., H. Lee, M. Park, et al. "Enhancement of differential signal integrity by employing a novel face via structure," IEEE Transactions on Electromagnetic Compatibility, Vol. 60, No. 1, 26-33, Feb. 2018.
doi:10.1109/TEMC.2017.2725943        Google Scholar

30. Chuang, H. H., W. D. Guo, Y. H. Lin, et al. "Signal/Power integrity modeling of high-speed memory modules using chip-package-board coanalysis," IEEE Transactions on Electromagnetic Compatibility, Vol. 52, No. 2, 381-391, May 2010.
doi:10.1109/TEMC.2010.2043108        Google Scholar