volume | PIER Journals

Abstract

This letter proposes a miniature bow-tie antenna element and its 2 × 2 arrays based on ball grid array (BGA) packaging technology for 5G millimeter-wave new radio (NR) applications. The antenna substrate uses ultra-economical single-layer FR4 printed circuit boards (PCB) to reduce manufacturing costs. By adopting solder balls, the antenna achieves the BGA packaging and realizes the surface mounting function. One bow-tie patch is excited by a plated through-hole (PTH) connected to the feeding point. The other bow-tie patch is directly short connected to the ground plane by another PTH. Besides, the bottom ground plane can be equivalent to a reflector, allowing the antenna element and array to obtain broadside radiation. For ease of integration, the input impedance of the antenna is set to 50 Ω. The measurement results show that the -10 dB bandwidth of the antenna element is 21% covering 25.2 to 31.1 GHz. The measured peak gains of the antenna element and the 2 × 2 arrays are 7.6 and 10.75 dBi, respectively. The proposed antenna element and array cover N257 (26.5-29.5 GHz) and N261 (27.5-28.35 GHz) bands. It is very suitable for the 5G millimeter-wave application.

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Dr. Xiubo Liu

Dr. Wei Zhang

Dr. Dongning Hao

Professor Yanyan Liu