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PIER PIER B PIER C PIER M PIER Letters PIER Photonics
2022-10-17
Power Absorption of 3D Printed Layers on a Microstrip Line
By
Chung-Yen Hsu,

    Dr. Chung-Yen Hsu

    Department of Electronic Engineering

    I-Shou University

    Taiwan

    Homepage

Lih-Shan Chen

    Dr. Lih-Shan Chen

    Department of Electronic Engineering

    I-Shou University

    Taiwan

    Homepage

Progress In Electromagnetics Research Letters, Vol. 107, 27-32, 2022
doi:10.2528/PIERL22080502 | Google Scholar

Abstract
Power-absorbing layers on a microstrip line prepared by 3D printing are investigated in this study. Polylactic acid (PLA) with added carbon is used in the 3D printing process for the preparation of the power-absorbing layers. The S-parameters of the 3D-printed layers are measured using a vector network analyzer. The effect of the layer thicknesses on the power absorption, which enables high-frequency devices to function correctly, is discussed. As the layer thickness increases, the magnitude of S11 increases, while the magnitude of S21 decreases accordingly. The experimental results show that the power absorption is within 80-95% (sheet resistance: 75.1 Ω/□-823.76 Ω/□), in the frequency range of 2-6 GHz. In addition, simulated S-parameter analysis was performed using a high-frequency structure simulator. The simulation results are in good agreement with the experimental results.
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Citation
Chung-Yen Hsu, and Lih-Shan Chen, "Power Absorption of 3D Printed Layers on a Microstrip Line," PIER Letters, Vol. 107, 27-32, 2022.
doi:10.2528/PIERL22080502
References

1. Ma, M. T. and M. Kanda, "Electromagnetic compatibility and interference metrology," NASA STI/Recon Technical Report, Vol. 87, 16217, 1986.        Google Scholar

2. Kim, S. H. and S. S. Kim, "Conduction noise absorption by ITO thin films attached to microstrip line utilizing Ohmic loss," J. Appl. Phys., Vol. 108, No. 2, 024904, Jul. 2010.
doi:10.1063/1.3456515        Google Scholar

3. Maruta, K., M. Sugawara, Y. Shimada, and M. Yamaguchi, "Analysis of optimum sheet resistance for integrated electromagnetic noise suppressors," IEEE Trans. Magn., Vol. 42, No. 10, 3377-3379, Sep. 2006.
doi:10.1109/TMAG.2006.879443        Google Scholar

4. Kim, S. S., "Numerical analysis on power absorption by Fe3O4 thin films for conduction noise in microstrip line," EEE Trans. Magn., Vol. 48, No. 11, 3490-3493, Oct. 201.
doi:10.1109/TMAG.2012.2198436        Google Scholar

5. Ohnuma, S., H. Nagura, H. Fujimori, and T. Masumoto, "Noise suppression effect of nanogranular Co based magnetic thin films at gigahertz frequency," IEEE Trans. Magn., Vol. 40, No. 4, 2712-2715, Aug. 2004.
doi:10.1109/TMAG.2004.834240        Google Scholar

6. Pissoort, D., J. Catrysse, T. Claeys, F. Vanhee, B. Boesman, and C. Brull, "Towards a stripline setup to characterise the effects of corrosion and ageing on the shielding effectiveness of EMI gaskets," 2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), 7-12, Dresden, Germany, 2015..
doi:10.1109/ISEMC.2015.7256123        Google Scholar

7. Zeng, Z., Y. Yao, and Y. Zhuang, "A wideband common-mode suppression filter with compact-defected ground structure pattern," IEEE Trans. Electromagn. Compat., Vol. 57, No. 5, 1277-1280, Jun. 2015.
doi:10.1109/TEMC.2015.2440424        Google Scholar

8. Liu, Q., S. Connor, C. Olivieri, and F. D. Paulis, "Reduction of EMI due to common-mode currents using a surface-mount EBG-based filter," IEEE Trans. Electromagn. Compat., Vol. 58, No. 5, 1440-1447, Jun. 2016.
doi:10.1109/TEMC.2016.2580701        Google Scholar

9. Manzoor, Z., M. T. Ghasr, and K. M. Donnell, "Microwave characterization of 3D printed conductive composite materials," 2018 IEEE International Instrumentation and Measurement Technology Conference (I2MTC), 1-5, Houston, TX, 2018.        Google Scholar

10. Viskadourakis, Z., K. C. Vasilopoulos, E. N. Economou, C. M. Soukoulis, and G. Kenanakis, "Electromagnetic shielding effectiveness of 3D printed polymer composites," Appl. Phys. A, Vol. 123, No. 12, 1-7, Nov. 2017.        Google Scholar

11. Prince, T. J., E. J. Riley, and S. W. Miller, "Additive manufacturing of PLA-based microwave circuit-analog absorbers," IEEE Trans. Electromagn. Compat., Vol. 63, No. 5, 1341-1346, 2021.
doi:10.1109/TEMC.2020.3044014        Google Scholar

12. Lim, D., S. Yu, and S. Lim, "Miniaturized metamaterial absorber using three-dimensional printed stair-like Jerusalem cross," IEEE Access, Vol. 6, 43654-43659, 2018.
doi:10.1109/ACCESS.2018.2862160        Google Scholar

13. Chou, Y. J., L. S. Chen, and M. P. Houng, "High-frequency noise absorption of Ag-Fe3O4 films on microstrip transmission line," IEEE Trans. Magn., Vol. 51, No. 4, 1-4, Jul. 2014.
doi:10.1109/TMAG.2014.2332973        Google Scholar

14. Lin, G. S., J. L. Chen, L. S. Chen, and M. P. Houng, "Effect of carbon black film on high-frequency power absorption," IEEE Microw. Wirel. Compon. Lett., Vol. 27, No. 9, 779-781, Aug. 2017.
doi:10.1109/LMWC.2017.2735544        Google Scholar

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