volume | PIER Journals

Abstract

Power-absorbing layers on a microstrip line prepared by 3D printing are investigated in this study. Polylactic acid (PLA) with added carbon is used in the 3D printing process for the preparation of the power-absorbing layers. The S-parameters of the 3D-printed layers are measured using a vector network analyzer. The effect of the layer thicknesses on the power absorption, which enables high-frequency devices to function correctly, is discussed. As the layer thickness increases, the magnitude of S₁₁ increases, while the magnitude of S₂₁ decreases accordingly. The experimental results show that the power absorption is within 80-95% (sheet resistance: 75.1 Ω/□-823.76 Ω/□), in the frequency range of 2-6 GHz. In addition, simulated S-parameter analysis was performed using a high-frequency structure simulator. The simulation results are in good agreement with the experimental results.

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Dr. Chung-Yen Hsu

Dr. Lih-Shan Chen