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PIER PIER B PIER C PIER M PIER Letters PIER Photonics
2008-01-19
Design of Single PIN Shorted Three-Dielectric-Layered Substrates Rectangular Patch Microstrip Antenna for Communication Systems
By
Aditi Sharma,

    Dr. Aditi Sharma

    Department of Electronics and Communication Engineering

    Jaypee University of Information Technology

    India

    Homepage

Ghanshyam Singh

    Prof. Ghanshyam Singh

    Department of Electronics and Communication Engineering

    Jaypee University of Information Technology

    India

    Homepage

Progress In Electromagnetics Research Letters, Vol. 2, 157-165, 2008
doi:10.2528/PIERL08010703 | Google Scholar

Abstract
In this paper, we have simulated a single-pin-shorted microstrip line fed three-dielectric-layer (with different permittivity and thickness) rectangular patch microstrip antenna for all those communication systems whose limited antenna size is premium. Low permittivity hard foam has been used as one substrate to achieve wide bandwidth. The simulation of this proposed antenna has been performed by using CST Microwave Studio, which is a commercially available electromagnetic simulator based on the finite difference time domain technique.
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Citation
Aditi Sharma, and Ghanshyam Singh, "Design of Single PIN Shorted Three-Dielectric-Layered Substrates Rectangular Patch Microstrip Antenna for Communication Systems," Progress In Electromagnetics Research Letters, Vol. 2, 157-165, 2008.
doi:10.2528/PIERL08010703
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