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PIER PIER B PIER C PIER M PIER Letters PIER Photonics
2015-08-19
Three-Step Molding Softlithographic Process for 1×2 Y-Branch POF Coupler
By
Mohd Shafiq Mat Ghazali,

    Dr. Mohd Shafiq Mat Ghazali

    Institute of Microengineering and Nanoelectronics (IMEN)

    Universiti Kebangsaan Malaysia

    Malaysia

    Homepage

Abang Annuar Ehsan

    Dr. Abang Annuar Ehsan

    Institute of Microengineering and Nanoelectronics (IMEN)

    Universiti Kebangsaan Malaysia

    Malaysia

    Homepage

Progress In Electromagnetics Research Letters, Vol. 55, 53-60, 2015
doi:10.2528/PIERL15052801 | Google Scholar

Abstract
A three-step molding softlithographic process has been developed for the construction of a sharp Y-junction structure formation in a 1x2 Y-branch plastic optical fiber (POF) coupler design. The 1x2 Y-branch POF coupler is based on a Y-junction splitter which requires that the splitting part is constructed with sharp infinitesimal junction. The softlithographic process enables a PDMS mold to be constructed which then allows mass replication of the polymer-based POF coupler. A standard master mold based on PMMA material is fabricated using CNC milling. A secondary or auxiliary-mold process step is then introduced in order to produce a sharp Y-junction structure which is then transferred to the final PDMS stamp prior to device replication. This step utilizes a free flowing, low viscosity casting-based resin, which after curing and hardening provide the auxiliary mold for PDMS mold fabrication. The result shows that a very fine and sharp Y-junction structure can be produced easily which cannot be produced via standard two step molding softlithographic process. Models for the Y-branch POF coupler produced with and without an auxiliary mold process are constructed which show that a 16% increased in optical performance with the device replicated with the auxiliary mold process.
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Citation
Mohd Shafiq Mat Ghazali, and Abang Annuar Ehsan, "Three-Step Molding Softlithographic Process for 1×2 Y-Branch POF Coupler," Progress In Electromagnetics Research Letters, Vol. 55, 53-60, 2015.
doi:10.2528/PIERL15052801
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