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PIER PIER B PIER C PIER M PIER Letters PIER Photonics
2018-04-04
A Miniaturized Multi-Channel TR Module Design Based on Silicon Substrate
By
Jun Zhou,

    Dr. Jun Zhou

    Guobo Electronics Company Limited

    China

    Homepage

Jiapeng Yang,

    Dr. Jiapeng Yang

    Nanjing Electronic Devices Institute

    China

    Homepage

Donglei Zhao,

    Dr. Donglei Zhao

    Nanjing Electronic Devices Institute

    China

    Homepage

Dongsheng Yang

    Dr. Dongsheng Yang

    Nanjing Electronic Devices Institute

    China

    Homepage

Progress In Electromagnetics Research Letters, Vol. 74, 117-123, 2018
doi:10.2528/PIERL17081604 | Google Scholar

Abstract
The block diagram of a TR (Transmit Receive) module that consists of four channels using a silicon substrate is presented in this paper. The silicon substrate fabricated by microelectronic process has been adopted to increase the interconnect density of module. Several broadband vertical transitions are simulated and optimized by EM simulator. The vertical transition works well from DC to 40 GHz. The insertion loss is less than 1 dB, and the return loss is better than -15 dB in back-to-back configuration. A novel TR module based on the silicon substrate is proposed for its miniaturization and high integration advantages. The module occupies a compact area of 30 mm×20 mm×1.8 mm, and the weight is 1.77 g.
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Citation
Jun Zhou, Jiapeng Yang, Donglei Zhao, and Dongsheng Yang, "A Miniaturized Multi-Channel TR Module Design Based on Silicon Substrate," Progress In Electromagnetics Research Letters, Vol. 74, 117-123, 2018.
doi:10.2528/PIERL17081604
References

1. Merkle, T. and R. Gotzen, "Millimeter-wave surface mount technology for 3-D printed polymer multichip modules," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 5, 201-206, 2015.
doi:10.1109/TCPMT.2014.2387232        Google Scholar

2. Mi, X., O. Toyoda, and S. Ueda, "A 3D heterogeneous integration method using LTCC wafer for RF applications," 2011 IEEE International 3D Systems Integration Conference (3DIC), 1-5, 2012.

3. Lim, K., S. Pinel, M. Davis, and A. Sutono, "RF-system-on-package (SOP) for wireless communications," IEEE Microwave Magazine, Vol. 3, 88-99, 2002.
doi:10.1109/MMW.2002.990700        Google Scholar

4. Tummala, R. R. and J. Laskar, "Gigabit wireless: System-on-a-package technology," Proceedings of the IEEE, Vol. 92, 376-387, 2004.
doi:10.1109/JPROC.2003.821902        Google Scholar

5. Juntunen, E., W. Khan, and C. Patterson, "An LCP packaged high-power, high-e±ciency CMOS millimeter-wave oscillator," 2011 IEEE MTT-S International Microwave Symposium, 1-4, 2011.

6. Tripodi, L., X. Hu, and R. Gotzen, "Broadband CMOS millimeter-wave frequency multiplier with vivaldi antenna in 3-D chip-scale packaging," IEEE Transactions on Microwave Theory and Techniques, Vol. 60, 3761-3768, 2012.
doi:10.1109/TMTT.2012.2220564        Google Scholar

7. Titz, D., R. Pilard, F. Ferrero, and F. Gianesello, "60 GHz antenna integrated on High Resistivity silicon technologies targeting WHDMI applications," 2011 IEEE Radio Frequency Integrated Circuits Symposium, 1-5, 2011.

8. Jin, C., V. N. Sekhar, and X. Bao, "Antenna-in-package design based on wafer-level packaging with through silicon via technology," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 3, 1498-1505, 2013.
doi:10.1109/TCPMT.2013.2261855        Google Scholar

9. Zhang, R., J. C. C. Lo, and S. W. R. Lee, "Design and fabrication of a silicon interposer with TSVs in cavities for three-dimensional IC packaging," IEEE Transactions on Device and Materials Reliability, Vol. 12, 189-193, 2012.
doi:10.1109/TDMR.2012.2190764        Google Scholar

10. Li, R., C. Jin, and S. C. Ong, "Embedded wafer level packaging for 77-GHz automotive radar front-end with through silicon via and its 3-D integration," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 3, 1481-1488, 2013.
doi:10.1109/TCPMT.2012.2236385        Google Scholar

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