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PIER PIER B PIER C PIER M PIER Letters PIER Photonics
2021-06-22
Surface Mounted Microstrip Antenna Using Ball Grid Array Packaging for mmWave Systems Integration
By
Xi Wang,

    Dr. Xi Wang

    School of Microelectronics

    Tianjin University

    China

    Homepage

Xiubo Liu,

    Dr. Xiubo Liu

    School of Microelectronics

    Tianjin University

    China

    Homepage

Wei Zhang,

    Dr. Wei Zhang

    School of Electrical Information Engineering

    Tianjin University

    China

    Homepage

Dongning Hao,

    Dr. Dongning Hao

    School of Microelectronics

    Tianjin University

    China

    Homepage

Yanyan Liu

    Professor Yanyan Liu

    Nankai University

    China

    Homepage

Progress In Electromagnetics Research Letters, Vol. 98, 105-111, 2021
doi:10.2528/PIERL21051207 | Google Scholar

Abstract
In this letter, two cost-effective surface-mount patch antenna elements for millimeter-wave (mmWave) systems using ball grid array (BGA) packaging are presented. A single-layer substrate based on FR4 is used to meet the low-cost requirements. The BGA packaging makes the proposed antenna element compact and easy to integrate. A U-slot is added to the patch to improve the impedance bandwidth of the patch antenna, and a vertical transition is designed to transmit the excitation signal by using a plated through-hole (PTH). The design process of the antenna is illustrated in detail. The antenna prototype has been simulated, fabricated, and measured to validate the design. The size of the fabricated prototype is 5 mm × 5 mm × 1.3 mm, which is very suitable for integration into a mmWave system.
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Citation
Xi Wang, Xiubo Liu, Wei Zhang, Dongning Hao, and Yanyan Liu, "Surface Mounted Microstrip Antenna Using Ball Grid Array Packaging for mmWave Systems Integration," Progress In Electromagnetics Research Letters, Vol. 98, 105-111, 2021.
doi:10.2528/PIERL21051207
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