volume | PIER Journals

Abstract

The paper presents integrated probe for direct coupling to the WR-10 waveguide with the use of metal filled vias on both sides of the microstrip line. Design and optimization of this novel microstrip-to-waveguide transition has been performed using 3-D finite element method based software HFSS (High Frequency Structure Simulator). A back-to-back transition has been fabricated and measured between 75--110 GHz. The measured return loss is higher than 10 dB and the insertion loss for a single microstrip-to-waveguide transition is about 1.15 dB.

1. Reljic, B. M., "Low loss MIC/MMIC compatible microstrip to waveguide transition without a balun," Microw. Optical Tech. Lett., Vol. 50, No. 1, 107-111, Jan. 2008.
doi:10.1002/mop.23012 Google Scholar

2. Bai, R., Y.-L. Dong, and J. Xu, "Broadband waveguide-to-microstrip antipodal finline transition without additional resonance preventer," IEEE Int. Symp. Microw. Antenna, Propagation, and EMC Tech. for Wireless Comm., 385-388, 2007.
doi:10.1109/MAPE.2007.4393629 Google Scholar

3. Kaneda, N., Y. X. Qian, and T. Itoh, "A broad-band microstrip-to-waveguide transition using quasi-Yagi antenna," IEEE Trans. Microw. Theory Tech., Vol. 47, No. 12, 2562-2567, Dec. 1999.
doi:10.1109/22.809007 Google Scholar

4. Grabherr, W., B. Huder, and W. Menzel, "Microstrip to waveguide transition compatible with mm-wave integrated circuits ," IEEE Trans. Microw. Theory Tech., Vol. 42, No. 9, 1842-1843, Sep. 1994.
doi:10.1109/22.310597 Google Scholar

5. Leong, Y.-C. and S. Weinreb, "Full band waveguide-to-microstrip probe transitions," IEEE MTT-S Symp. Dig., Vol. 4, 1435-1438, 1999. Google Scholar

6. Nguyen, B. D., C. Migliaccio, C. Pichot, and N. Rolland, "Design of microstrip to waveguide transition in the W band suitable antenna or integrated circuits connections," Microw. Optical Tech. Lett., Vol. 47, No. 6, 518-520, Dec. 2005.
doi:10.1002/mop.21216 Google Scholar

7. Weinreb, S., T. Gaier, R. Lai, M. Barsky, Y. C. Leong, and L. Samoska, "High-gain 150-215 GHz MMIC amplifier with integral waveguide transitions," IEEE Microw. Guided Wave Lett., Vol. 9, No. 7, 282-284, Jul. 1999.
doi:10.1109/75.774148 Google Scholar

8. Ponchak, G. E., D. Chun, J.-G. Yook, and L. P. B. Katehi, "The use of metal filled via holes for improving isolation in LTCC RF and wireless multichip packages," IEEE Trans. Microw. Theory Tech., Vol. 23, No. 1, 88-99, Feb. 2009. Google Scholar

Ms. Rownak Shireen

Dr. Shouyuan Shi

Dr. Dennis W. Prather