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PIER PIER B PIER C PIER M PIER Letters PIER Photonics
2013-06-29
Conductor Fusing and Gapping for Bond Wires
By
Kenneth Chien-Ying Chen,

    Dr. Kenneth Chien-Ying Chen

    Sandia National Labs

    USA

    Homepage

Larry Kevin Warne,

    Dr. Larry Kevin Warne

    Sandia National Laboratories

    USA

    Homepage

Yau Tang Lin,

    Dr. Yau Tang Lin

    Sandia National Laboratories

    USA

    Homepage

Robert L. Kinzel,

    Dr. Robert L. Kinzel

    Sandia National Laboratories

    USA

    Homepage

Johnathon D. Huff,

    Dr. Johnathon D. Huff

    Sandia National Laboratories

    USA

    Homepage

Michael B. McLean,

    Dr. Michael B. McLean

    Sandia National Laboratories

    USA

    Homepage

Mark W. Jenkins,

    Dr. Mark W. Jenkins

    Sandia National Laboratories

    USA

    Homepage

Brian M. Rutherford

    Dr. Brian M. Rutherford

    Sandia National Laboratories

    USA

    Homepage

Progress In Electromagnetics Research M, Vol. 31, 199-214, 2013
doi:10.2528/PIERM13051311 | Google Scholar

Abstract
In this paper, fusing of a metallic conductor is studied by judiciously using the solution of the one-dimensional heat equation, resulting in an approximate method for determining the threshold fusing current. The action is defined as an integration of the square of the wire current over time. The burst action (the action required to completely vaporize the material) for an exploding wire is then used to estimate the typical wire gapping action (involving wire fusing), from which gapping time can be estimated for a gapping current greater than a factor of two over the fusing current. The test data are used to determine the gapped length as a function of gapping current and to show, for a limited range, that the gapped length is inversely proportional to gapping time. The gapping length can be used as a signature of the fault current level in microelectronic circuits.
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Citation
Kenneth Chien-Ying Chen, Larry Kevin Warne, Yau Tang Lin, Robert L. Kinzel, Johnathon D. Huff, Michael B. McLean, Mark W. Jenkins, and Brian M. Rutherford, "Conductor Fusing and Gapping for Bond Wires," Progress In Electromagnetics Research M, Vol. 31, 199-214, 2013.
doi:10.2528/PIERM13051311
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