1. Moore, G. E., "Cramming more components into integrated circuits," Electronics, Vol. 38, No. 8, 114-117, 1965. Google Scholar
2., Renault, "Resistance to electrical disturbances and electromagnetic compatibility instructions concerning electrical, electronic and pyrotechnic equipment,", Product Specification 36-00-808/-G, Rev. D, Oct.2000. Google Scholar
3. Williams, B. W., "Principles and elements of power electronics, devices, drivers, applications, and passive components,", Free eBook:share ebook, 986,2006, ISBN 978-0-9553384-0-3.. Google Scholar
4. Neugebauer, T. C. and D. J. Perreault, "Filters with inductance cancellation using printed circuit board transformers," Proc. PESC'03, IEEE 34th Annual Conf., Vol. 1, 272-282, 2003. Google Scholar
5. Wang, S., F. C. Lee, D. Y. Chen, and W. G. Odendaal, "Effects of parasitic parameters on EMI filter performance," IEEE Trans. Power Electronics, Vol. 19, No. 3, 869-877, May 2004.
doi:10.1109/TPEL.2004.826527 Google Scholar
6. Mawby, A., P. M. Igic, and M. S. Towers, "New physics-based compact electro-thermal model of power diode dedicated to circuit simulation," Proc. IEEE ISCAS 2001, Vol. 2, 401-404, Sydney, Australia, May 2001. Google Scholar
7. Vuolevi, J. and T. Rahkonen, "Extracting a polynomial ac FET model with thermal couplings from S-parameter measurements," Proc. IEEE ISCAS 2001, Vol. 2, 461-464, Sydney, Australia, May 2001. Google Scholar
8. Renken, F., "High temperature electronics for future hybrid drive systems," 13th European Conf. on Power Electronics and Applications, Proc. EPE-PEMC 2009, 14th Int. Power Electronics and Motion Control Conf, 8-10, Barcelona, Spain, Sep. 2009. Google Scholar
9. Song, S. and K. P. Morgan, "Thermal and electrical resistances of bolted joints between plates of unequal thickness," Semiconductor Thermal Measurement and Management Symp., 1993, SEMI- HERM IX., Ninth Annual IEEE, Austin, TX, USA, Feb. 1993. Google Scholar
10. Wagner, D., "Modeling thermal effects in RF LDMOS tran- sistors,", MOTOROLA Semiconductor Application Note, 1-7, AN1941, 2002. Google Scholar
11. Suter, P., R. Bauknecht, T. Graf, H. Duran, and I. Venter, "Thermo-mechanical finite-element modeling of a chip-on-foil bonding process," Proc. of the 6th Inter. Conf. on Thermal, Mechanical and Multi-physics Simulation and Experiments in Micro-electronics and Micro-systems, EuroSimE 2005, , 25-30, Apr. 18-20, 2005. Google Scholar
12. Deplanque, S., W. Nuchter, M. Spraul, B. Wunderie, R. Dudek, and B. Michel, "Relevance of primary creep in thermo-mechanical cycling for life-time prediction in Sn-based solders," Proc. of the 6th Int. Conf. on Thermal, Mechanical and Multi-physics Simulation and Experiments in Micro-electronics and Micro-systems, EuroSimE 2005,, 71-78, Apr. 18-20, 2005. Google Scholar
13. Sagko, H., S. Sinaga, J. N. Burghartz, B. Rejaei, and A. Akhnoukh, "Thermal effects in suspended RF spiral inductors," IEEE Electron. Device Letters, Vol. 26, No. 8, 541-543, 2005.
doi:10.1109/LED.2005.852524 Google Scholar
14. London, S., D. Fricano, A. Dasgupta, T. Reinikaininen, G. Freitas, and C. Pagliosa, "Probabilistic effects in thermal cycling failures of high-I/O BGA assemblies," Proc. of the 10th Int. Conf. on Thermal, Mechanical and Multi-physics Simulation and Experiments in Micro-electronics and Micro-systems, EuroSimE 2009,, 1-7, Apr. 26-29, 2009. Google Scholar
15. Jian-Ping, L., Y. Ping, Z. Jian, C. Quayle, C. Jing, L. Xu, and A. Salo, "Thermal analysis based on the environmental tests of STN display," Proc. of the 10th Int. Conf. on Thermal Mechanical and Multi-physics Simulation and Experiments in Micro-electronics and Micro-systems, EuroSimE 2009,, 1-6, Apr. 26-29, 2009. Google Scholar
16. Bowick, C., "RF circuit design," Elsevier Science, Burlington, 1982. Google Scholar
17. Pena, A. E., M. Bensetti, F. Duval, and B. Ravelo, "Modeling of passive components from the measured S-parameters and application for low-pass filter characterization," Proc. of EPE- PEMC 2010, 14th Int. Power Electronics and Motion Control Conf., Ohrid, Republic of Macedonia, Sep. 6-8, 2010. Google Scholar
18. Naishadham, K., "Experimental equivalent circuit modeling of SMD inductors for printed circuit applications," IEEE Trans. EMC, Vol. 43, No. 4, 557-565, 2001. Google Scholar
19. Bensetti, M., Y. Le Bihan, and C. Marchand, "Non-destructive evaluation of layered planar media using MLP and RBF neural networks," The 8th International Workshop on Electromagnetic Nondestructive Evaluation, Saarbrucken, Allemagne, 2002. Google Scholar
20., http://www.mathworks.fr/.. Google Scholar
21. Malki, M. A., D. Baudry, and M. Ramdani, "New tool for characterizations of electronic components radiated emissions under thermal constraints," EMC Compo 09, Toulouse, France, Nov. 2009. Google Scholar