Vol. 71
Latest Volume
All Volumes
PIERM 130 [2024] PIERM 129 [2024] PIERM 128 [2024] PIERM 127 [2024] PIERM 126 [2024] PIERM 125 [2024] PIERM 124 [2024] PIERM 123 [2024] PIERM 122 [2023] PIERM 121 [2023] PIERM 120 [2023] PIERM 119 [2023] PIERM 118 [2023] PIERM 117 [2023] PIERM 116 [2023] PIERM 115 [2023] PIERM 114 [2022] PIERM 113 [2022] PIERM 112 [2022] PIERM 111 [2022] PIERM 110 [2022] PIERM 109 [2022] PIERM 108 [2022] PIERM 107 [2022] PIERM 106 [2021] PIERM 105 [2021] PIERM 104 [2021] PIERM 103 [2021] PIERM 102 [2021] PIERM 101 [2021] PIERM 100 [2021] PIERM 99 [2021] PIERM 98 [2020] PIERM 97 [2020] PIERM 96 [2020] PIERM 95 [2020] PIERM 94 [2020] PIERM 93 [2020] PIERM 92 [2020] PIERM 91 [2020] PIERM 90 [2020] PIERM 89 [2020] PIERM 88 [2020] PIERM 87 [2019] PIERM 86 [2019] PIERM 85 [2019] PIERM 84 [2019] PIERM 83 [2019] PIERM 82 [2019] PIERM 81 [2019] PIERM 80 [2019] PIERM 79 [2019] PIERM 78 [2019] PIERM 77 [2019] PIERM 76 [2018] PIERM 75 [2018] PIERM 74 [2018] PIERM 73 [2018] PIERM 72 [2018] PIERM 71 [2018] PIERM 70 [2018] PIERM 69 [2018] PIERM 68 [2018] PIERM 67 [2018] PIERM 66 [2018] PIERM 65 [2018] PIERM 64 [2018] PIERM 63 [2018] PIERM 62 [2017] PIERM 61 [2017] PIERM 60 [2017] PIERM 59 [2017] PIERM 58 [2017] PIERM 57 [2017] PIERM 56 [2017] PIERM 55 [2017] PIERM 54 [2017] PIERM 53 [2017] PIERM 52 [2016] PIERM 51 [2016] PIERM 50 [2016] PIERM 49 [2016] PIERM 48 [2016] PIERM 47 [2016] PIERM 46 [2016] PIERM 45 [2016] PIERM 44 [2015] PIERM 43 [2015] PIERM 42 [2015] PIERM 41 [2015] PIERM 40 [2014] PIERM 39 [2014] PIERM 38 [2014] PIERM 37 [2014] PIERM 36 [2014] PIERM 35 [2014] PIERM 34 [2014] PIERM 33 [2013] PIERM 32 [2013] PIERM 31 [2013] PIERM 30 [2013] PIERM 29 [2013] PIERM 28 [2013] PIERM 27 [2012] PIERM 26 [2012] PIERM 25 [2012] PIERM 24 [2012] PIERM 23 [2012] PIERM 22 [2012] PIERM 21 [2011] PIERM 20 [2011] PIERM 19 [2011] PIERM 18 [2011] PIERM 17 [2011] PIERM 16 [2011] PIERM 14 [2010] PIERM 13 [2010] PIERM 12 [2010] PIERM 11 [2010] PIERM 10 [2009] PIERM 9 [2009] PIERM 8 [2009] PIERM 7 [2009] PIERM 6 [2009] PIERM 5 [2008] PIERM 4 [2008] PIERM 3 [2008] PIERM 2 [2008] PIERM 1 [2008]
2018-07-30
Chip-Package Co-Design for Optimization of 5.8 GHz LNA Performance Based on Embedded Inductors
By
Progress In Electromagnetics Research M, Vol. 71, 95-105, 2018
Abstract
This paper presents the design and demonstration of an optimized land grid array (LGA) structure for low noise amplifier (LNA). In order to achieve better circuit performance, the novel chip-package co-design method based on embedded inductors is used. The optimized structure is accurately modeled by ANSYS software. S-parameter is utilized to help in understanding the contributing to the optimized LGA structure. The simulation results for the novel LNA co-design structure show the gain 14.35 dB (> 10 dB), input reflection coefficient -15.63 dB (< -10 dB), output reflection coefficient -24.43 dB (< -10 dB), reverse-isolation -44.7 dB (< -20 dB), and noise figure 2.99 dB (< 4 dB), and indicate that the optimized LGA structure based on embedded inductors is fully capable of supporting 5.8 GHz LNA application.
Citation
Haiyan Sun, Wenjun Sun, Ling Sun, Jicong Zhao, Yihong Peng, Jiaen Fang, Xiaoyong Miao, and Honghui Wang, "Chip-Package Co-Design for Optimization of 5.8 GHz LNA Performance Based on Embedded Inductors," Progress In Electromagnetics Research M, Vol. 71, 95-105, 2018.
doi:10.2528/PIERM18051403
References

1. Lin, Y. C., W. H. Lee, T. S. Horng, and L. T. Hwang, "Full chip-package-board co-design of broadband QFN bonding transition using backside via and defected ground structure," IEEE Transactions on Components Packaging & Manufacturing Technology, Vol. 4, No. 9, 1470-1479, 2017.

2. Yeh, H. C., C. C. Chiong, S. Aloui, and H. Wang, "Analysis and design of millimeter-wave low-voltage CMOS cascode LNA with magnetic coupled technique," IEEE Transactions on Microwave Theory & Techniques, Vol. 60, No. 12, 4066-4079, 2012.
doi:10.1109/TMTT.2012.2224365

3. Li, L., K. Ma, and S. Mou, "Modeling of new spiral inductor based on substrate integrated suspended line technology," IEEE Transactions on Microwave Theory & Techniques, Vol. 65, No. 8, 2672-2680, 2017.
doi:10.1109/TMTT.2017.2701374

4. Yue, C. P. and S. S. Wong, "Physical modeling of spiral inductors on silicon," IEEE Transactions on Electron Devices, Vol. 47, No. 3, 560-568, 2002.
doi:10.1109/16.824729

5. Fang, X., R. Wu, and J. K. O. Sin, "Analytical modeling of AC resistance in thick coil integrated spiral inductors," IEEE Transactions on Electron Devices, Vol. 63, No. 2, 760-766, 2016.
doi:10.1109/TED.2015.2507198

6. Li, S., S. Smaili, and Y. Massoud, "Parasitic-aware design of integrated DC-DC converters with spiral inductors," IEEE Transactions on Very Large Scale Integration Systems, Vol. 23, No. 12, 3076-3084, 2015.
doi:10.1109/TVLSI.2014.2387278

7. Chuluunbaatar, Z., K. K. Adhikari, C. Wang, and N. Y. Kim, "Micro-fabricated bandpass filter using intertwined spiral inductor and interdigital capacitor," Electronics Letters, Vol. 50, No. 18, 1296-1297, 2014.
doi:10.1049/el.2014.2040

8. Lin, K. C., H. K. Chiou, and P. C. Wu, "2.4-GHz complementary metal oxide semiconductor power amplifier using high-quality factor wafer-level bondwire spiral inductor," IEEE Transactions on Components Packaging & Manufacturing Technology, Vol. 3, No. 8, 1286-1292, 2013.
doi:10.1109/TCPMT.2012.2227260

9. Xu, X., P. Li, M. Cai, and B. Han, "Design of novel high-Q-factor multipath stacked on-chip spiral inductors," IEEE Transactions on Electron Devices, Vol. 59, No. 8, 2011-2018, 2012.
doi:10.1109/TED.2012.2197626

10. Mohan, S. S., M. H. M. Del, S. P. Boyd, and T. H. Lee, "Simple accurate expressions for planar spiral inductances," IEEE J. Solid-State Circuits, Vol. 34, No. 10, 1419-1424, 1999.
doi:10.1109/4.792620

11. Ludwig, R. and G. Bogdanov, RF Circuit Design: Theory and Applications, R. Ludwig, G. Bogdanov, 410, Upper Saddle River, NJ, 2000.