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Vol. 97

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2021-03-01 PIER Letters Vol. 97, 1-6, 2021. doi:10.2528/PIERL21010605

Microstrip Crossover on FR-4 Substrate

Takeru Inaba and Hitoshi Hayashi

This letter shows a compact planar microstrip crossover. The crossover design employs a microstrip to coplanar waveguide transition. The crossover is fabricated on a low cost and readily available FR-4 substrate, and simulation and measurement responses in the low frequency band have been shown. The number of GND vias forming a quasi-coaxial section that confined the electric field around the signal via was increased to improve impedance matching. The core size of the circuit is as compact as 20 mm × 10 mm even in the low frequency band. The crossover operates in the low frequency band with insertion loss of less than 1 dB, return loss of more than 10 dB, and isolation of more than 15 dB.