Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
China
Homepage
State Key Laboratory of Transducer Technology, Science and Technology on Microsystem Laboratory
Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
China
Homepage
State Key Laboratory of Transducer Technology, Science and Technology on Microsystem Laboratory
Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
China
Homepage
State Key Laboratory of Transducer Technology
Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
China
Homepage1. Liu, L., et al. "Compact harmonic filter design and fabrication using IPD technology," IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 4, 556-562, 2007.
doi:10.1109/TCAPT.2007.901672 Google Scholar
2. Zoschke, K., et al. "Wafer level processing of integrated passive components using polyimide or polybenzoxazole/copper multilayer technology," IEEE Transactions on Advanced Packaging, Vol. 33, No. 2, 398-407, 2010.
doi:10.1109/TADVP.2009.2037729 Google Scholar
3. Zoschke, K., et al. "Fabrication of application specific integrated passive devices using wafer level packaging technologies," IEEE Transactions on Advanced Packaging, Vol. 30, No. 3, 359-368, 2007.
doi:10.1109/TADVP.2007.901770 Google Scholar
4. Han, M., G. Xu, and L. Luo, "High performance silicon-based inductors for RF integrated passive devices," Progress In Electromagnetics Research, Vol. 146, 181-186, 2014.
doi:10.2528/PIER14040803 Google Scholar
5. Han, M., et al. "Suspended high Q integrated inductor by wafer level packaging technology," Microsystem Technologies-Micro- and Nanosystems-Information Storage and Processing Systems, Vol. 21, No. 1, 215-219, 2015. Google Scholar
6. Kattelus, H., H. Ronkainen, and T. Riihisaari, "Passive integration process on standard and high resistivity silicon," 1999 International Conference on High Density Packaging and MCMS, Proceedings, Vol. 3830, 194-199, 1999. Google Scholar
7. Kim, D. W., et al. "High performance RF passive integration on a Si smart substrate for wireless applications," Etri Journal, Vol. 25, No. 2, 65-72, 2003.
doi:10.4218/etrij.03.0102.0207 Google Scholar
8. Zoschke, K., et al. "Thin film integration of passives - Single components, filters, integrated passive devices," 54th Electronic Components & Technology Conference, Vols. 1 and 2, Proceedings, 294-301, 2004. Google Scholar
9. Pacheco, S., et al. "Compact low and high band harmonic filters using an integrated passives device (IPD) technology," 2006 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, Digest of Papers, 346-349, 2006. Google Scholar
10. Wu, S.-M., C.-T. Kuo, and C.-H. Chen, "Very compact full differential bandpass filter with transformer integrated using integrated passive device technology," Progress In Electromagnetics Research, Vol. 113, 251-267, 2011.
doi:10.2528/PIER10121701 Google Scholar
11. Wu, Z. Z., L. Gu, and X. X. Li, "Post-CMOS compatible micromachining technique for on-chip passive RF filter circuits," IEEE Transactions on Components and Packaging Technologies, Vol. 32, No. 4, 759-765, 2009.
doi:10.1109/TCAPT.2009.2020411 Google Scholar
12. Yook, J. M., D. Kim, and J. C. Kim, "High-Q trenched spiral inductors and low-loss low pass filters using through silicon via processes," Japanese Journal of Applied Physics, Vol. 53, No. 4, 2014. Google Scholar
13. Yook, J. M., K. M. Kim, and Y. S. Kwon, "Suspended spiral inductor and band-pass filter on thick anodized aluminum oxide," IEEE Microwave and Wireless Components Letters, Vol. 19, No. 10, 620-622, 2009.
doi:10.1109/LMWC.2009.2029735 Google Scholar
14. Hong, J. S. and M. J. Lancaster, Microstrip Filters for RF/Microwave Applications, John Wiley & Sons, 2001.
doi:10.1002/0471221619
