volume | PIER Journals

Abstract

This study investigates the generation and mitigation of common-mode noise (CMN) in a common structure which consists of differential traces with adjacent ground lines and a ground plane. For simplicity, a simple test structure similar to the common structure is proposed. The test structure is divided into three parts. One part is composed of differential traces with adjacent ground lines. The second is composed of differential traces with adjacent ground lines that are connected to a ground plane. The third comprises differential traces with an adjacent ground line and an adjacent ground plane. The generation and mitigation of CMN in these three parts are studied. Test structures with different designs are investigated to confirm the effectiveness of the CMN mitigation schemes. Based on these analyses, design guidelines for mitigating CMN are provided. The proposed design guidelines reduce the peak-to-peak CMN amplitude by 81% from that achieved using unsuitable design of test structure. In the frequency domain, the reduction of the magnitude of differential-to-common mode conversion (|S_cd21|) at the resonant peaks exceeded 40 dB in the frequency range 0 GHz~6 GHz. Finally, a favorable comparison between simulated and measured results verifies the favorable CMN mitigation performance of the proposed design guidelines.

1. Fan, J., X. Ye, J. Kim, B. Archambeault, and A. Orlandi, "Signal integrity design for high-speed digital circuits: Progress and directions," IEEE Trans. Electromagn. Compat., Vol. 52, No. 2, 392-400, May 2010.
doi:10.1109/TEMC.2010.2045381 Google Scholar

2. Bogatin, E., Signal Integrity-simplified, Prentice Hall Modern Semiconductor Design Series' Sub Series: PH Signal Integrity Library, 2003.

3. Paul, C. R., Introduction to Electromagnetic Compatibility, 2nd Ed., Wiley, 2006.

4. Paul, C. R., "Solution of the transmission-line equations under the weak-coupling assumption," IEEE Trans. Electromagn. Compat., Vol. 44, No. 3, 413-423, Aug. 2002.
doi:10.1109/TEMC.2002.801753 Google Scholar

5. Mbairi, F. D., W. P. Siebert, and H. Hesselbom, "On the problem of using guard traces for high frequency differential lines crosstalk reduction," IEEE Trans. Comp. and Packag. Tech., Vol. 30, No. 1, 67-74, Apr. 2009.
doi:10.1109/TCAPT.2007.892072 Google Scholar

6. Ladd, D. N. and G. I. Costache, "SPICE simulation used to characterize the cross-talk reduction effect of additional tracks grounded with vias on printed circuit boards," IEEE Trans. Circuits Syst. II, Vol. 39, 342-347, Jun. 1992.
doi:10.1109/82.145291 Google Scholar

7. Novak, I., B. Eged, and L. Hatvani, "Measurement by vector-network analyzer and simulation of crosstalk reduction on printed circuitboards with additional center traces," Instrumentation Measurement Technol. Conf., 269-274, Irvine, CA, May 1993. Google Scholar

8. Suntives, A., A. Khajooeizadeh, and R. Abhari, "Using via fences for crosstalk reduction in PCB circuits," 2006 IEEE Int. Symp. Electromagnetic Compat., 34-37, Portand, Orgeon, USA, Aug. 14-18, 2006. Google Scholar

9. Cheng, Y. S., W. D. Guo, G. H. Shiue, H. H. Cheng, C. C. Wang, and R. B. Wu, "Fewest vias design for microstrip guard trace by using overlying dielectric," 2008 IEEE-EPEP, 321-324, San Jose, CA, Oct. 27-29, 2008. Google Scholar

10. Hung, H. C., S. L. Hong, K. S. A. Chou, Z. X. Chen, C. H. Ting, S. C. Hsu, L. C. Chen, and G. H. Shiue, "Common-mode noise effect for differential traces adjacent ground lines connection a ground plane," 2015 Asia-Pacific Symp. Electromagnetic Compat., 502-505, Taipei, Taiwan, R.O.C., May 26-29, 2015. Google Scholar

11. Ansys HFSS, ver. 13, Ansys, Pittsburgh, PA, [Online], Available: www.ansys.com.

12. "CST Microwave Studio,", Manual Computer Simulation Technology, Germany, 2003, Online, Available: www.cst.com. Google Scholar

13. Fan, W., A. Lu, L. L.Wai, and B. K. Lok, "Mixed-mode S-parameter characterization of differential structures," Proc. IEEE 5th Electron. Packag. Technol. Conf., 533-537, Dec. 2003. Google Scholar

14. Shiue, G. H., C. L. Yeh, P. W. Huang, H. Y. Liao, and Z. H. Zhang, "Ground bounce noise induced by crosstalk noise for two parallel ground planes with a narrow open-stub line and adjacent signal traces in multilayer package structure," IEEE Trans. Comp. and Packag. Tech., 2014. Google Scholar

15. Cheng, Y. S., W. D. Guo, C. P. Hung, R. B. Wu, and D. D. Zutter, "Enhanced microstrip guard trace for ringing noise suppression using a dielectric superstrate," IEEE Trans. Adv. Packag., Vol. 33, No. 4, 961-968, Nov. 2010.
doi:10.1109/TADVP.2010.2040033 Google Scholar

16. Hong, J.-S. G. and M. J. Lancaster, Microstrip Filter for RF/Microwave Applications, Chapter 4, Wiley, New York, 2001.

Prof. Guang-Hwa Shiue

Dr. Zhong-Yan You

Dr. Yu-Hsiang Cheng

Dr. Ting-Chun Wang

Dr. Kuang-Yi Wu

Dr. Ming-Yuan Chuang

Dr. Chun-Fu Huang