volume | PIER Journals

Abstract

This paper proposes a method to calculate temperature distribution by analyzing periodic units, enabling efficient simulation of electromagnetic-thermal problems in periodic structures. Compared with traditional methods that require high memory and long computation times to process the entire large-scale model, this approach significantly reduces computational complexity by focusing on a single periodic unit and incorporating periodic thermal boundary conditions. In the study, electromagnetic losses are considered as the heat source, and the formula for periodic thermal boundary conditions is derived in conjunction with the heat conduction equation, achieving the integration of periodic electromagnetic-thermal boundary conditions. Numerical validation and comparison with global model results demonstrate that the proposed method maintains accuracy while achieving high efficiency. Furthermore, the method is applied to an artificial magnetic conductor (AMC) model, with calculation results closely matching those of large-scale unit arrays, further verifying the correctness and applicability of the algorithm.

1. El Mahgoub, Khaled, Fan Yang, Atef Z. Elsherbeni, Veysel Demir, and Ji Chen, "FDTD analysis of periodic structures with arbitrary skewed grid," IEEE Transactions on Antennas and Propagation, Vol. 58, No. 8, 2649-2657, Aug. 2010. Google Scholar

2. El Mahgoub, Khaled, Fan Yang, and Atef Z. Elsherbeni, "FDTD/GSM analysis of multilayered periodic structures with arbitrary skewed grid," IEEE Transactions on Microwave Theory and Techniques, Vol. 59, No. 12, 3264-3271, Dec. 2011. Google Scholar

3. El Mahgoub, Khaled, Atef Z. Elsherbeni, and Fan Yang, "Dispersive periodic boundary conditions for finite-difference time-domain method," IEEE Transactions on Antennas and Propagation, Vol. 60, No. 4, 2118-2122, Apr. 2012. Google Scholar

4. Ou, Naiming, Ming Bai, Bin Liang, and Jungang Miao, "The analysis of periodic structures with 2-D-staggered grid by FDTD algorithm," IEEE Transactions on Antennas and Propagation, Vol. 61, No. 1, 290-298, Jan. 2013. Google Scholar

5. Tekbas, Kenan, Fumie Costen, Jean-Pierre Bérenger, Ryutaro Himeno, and Hideo Yokota, "Subcell modeling of frequency-dependent thin layers in the FDTD method," IEEE Transactions on Antennas and Propagation, Vol. 65, No. 1, 278-286, Jan. 2017. Google Scholar

6. Zhang, Hao-Xuan, Qiwei Zhan, Li Huang, Yin-Da Wang, Wei-Jie Wang, Zikang Qin, Zhen-Guo Zhao, Da-Wei Wang, Hai-Jing Zhou, Kai Kang, Liang Zhou, and Wen-Yan Yin, "A scalable HPC-based domain decomposition method for multiphysics modeling of RF devices," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 11, No. 12, 2158-2170, 2021. Google Scholar

7. Xue, Yilun, Qiang Ren, Jiefu Chen, and Yuanguo Zhou, "Transient electromagnetic-thermal cosimulation for micrometer-level components," IEEE Transactions on Microwave Theory and Techniques, Vol. 69, No. 10, 4341-4351, 0ct. 2021. Google Scholar

8. Zhang, Hao-Xuan, Li Huang, Wei-Jie Wang, Zhen-Guo Zhao, Liang Zhou, Wenchao Chen, Haijing Zhou, Qiwei Zhan, Branko Kolundzija, and Wen-Yan Yin, "Massively parallel electromagnetic-thermal cosimulation of large antenna arrays," IEEE Antennas and Wireless Propagation Letters, Vol. 19, No. 9, 1551-1555, Sep. 2020. Google Scholar

9. Lu, Tianjian and Jian-Ming Jin, "Coupled electrical-thermal-mechanical simulation for the reliability analysis of large-scale 3-D interconnects," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 7, No. 2, 229-237, Feb. 2017. Google Scholar

10. Zhang, Huan Huan, Zheng Lang Jia, Peng Fei Zhang, Ying Liu, Li Jun Jiang, and Da Zhi Ding, "Electromagnetic-circuital-thermal-mechanical multiphysics numerical simulation method for microwave circuits," IEEE Journal on Multiscale and Multiphysics Computational Techniques, Vol. 9, 129-141, 2024. Google Scholar

11. Bui, H. K., F. D. Senghor, G. Wasselynck, D. Trichet, J. Fouladgar, K. Lee, and G. Berthiau, "Characterization of electrical conductivity of anisotropic CFRP materials by means of induction thermography technique," IEEE Transactions on Magnetics, Vol. 54, No. 3, 1-4, Mar. 2018. Google Scholar

12. Kotlan, Vaclav, David Panek, Roman Hamar, and Ivo Dolezel, "Shape optimization of deposited layer produced by combined cladding process," IEEE Transactions on Magnetics, Vol. 54, No. 3, 1-4, Mar. 2018. Google Scholar

13. Jiang, Yapeng, Dong Wang, Junquan Chen, Qinghu Zhang, and Teng Xuan, "Electromagnetic-thermal-fluidic analysis of permanent magnet synchronous machine by bidirectional method," IEEE Transactions on Magnetics, Vol. 54, No. 3, 1-5, Mar. 2018. Google Scholar

14. Wang, Jingxia, Ming Cheng, Wei Qin, and Quanqiang Liu, "Fast calculation method of bi-direction coupling between electromagnetic-thermal field for FSPM motor," IEEE Transactions on Magnetics, Vol. 59, No. 12, 1-9, Dec. 2023. Google Scholar

15. Zhang, Hao-Xuan, Li Huang, Wei-Jie Wang, Zhen-Guo Zhao, Liang Zhou, Wenchao Chen, Haijing Zhou, Qiwei Zhan, Branko Kolundzija, and Wen-Yan Yin, "Massively parallel electromagnetic-thermal cosimulation of large antenna arrays," IEEE Antennas and Wireless Propagation Letters, Vol. 19, No. 9, 1551-1555, Sep. 2020. Google Scholar

16. Zhang, Huan Huan, Zheng Lang Jia, Peng Fei Zhang, Ying Liu, Li Jun Jiang, and Da Zhi Ding, "Electromagnetic-circuital-thermal-mechanical multiphysics numerical simulation method for microwave circuits," IEEE Journal on Multiscale and Multiphysics Computational Techniques, Vol. 9, 129-141, 2024. Google Scholar

17. Wu, Shihong, Ping Wang, and Yuxin Qiao, "Factorization-splitting algorithm based on system incorporated method for periodic nonuniform domains in open regions," International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, Vol. 36, No. 6, e3123, 2023. Google Scholar

18. Lu, Yi, Juan Chen, Jianxing Li, and Wenjing Xu, "A study on the electromagnetic-thermal coupling effect of cross-slot frequency selective surface," Materials, Vol. 15, No. 2, 640, Jan. 2022. Google Scholar

Dr. Zhonghui Li

Professor Minquan Li

Dr. Xian-Liang Wu

Dr. Shuangqing Cao

Dr. Rongxian Bai