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2009-10-12
Full-Wave Modeling of Multiple Vias Using Differential Signaling and Shared Antipad in Multilayered High Speed Vertical Interconnects
By
Progress In Electromagnetics Research, Vol. 97, 129-139, 2009
Abstract
A 3D full-wave approach, based on the Foldy-Lax multiple scattering equations, is successfully extended to model massively-coupled multiple vias using differential signaling and shared antipad in high speed vertical interconnects. For the first time, this method has been used and tested on via-pair with shared antipad in multilayered structure. The magnetic frill current source on the port is calculated by using the finite difference method. Banded matrix iterative method is applied to accelerate the finite difference calculation. Numerical example of 15 signal via-pairs and 20 ground shielding vias in 6-layer board demonstrates that this approach is able to model the via-pair with shared antipad and to include all the coupling effects among multiple vias. The electrical performances of different signal driving schemes are provided and discussed. The coupling crosstalk on various via-pairs is compared. The improvement of signal integrity is shown by using differential signaling and shared antipad for via-pair in multilayered structure. The results are compared with HFSS and SIwave in accuracy and CPU. The CPU using Foldy-Lax approach is three orders of magnitude faster than using HFSS, and two orders of magnitude faster than using SIwave. The accuracy of Foldy-Lax is within 2% difference from HFSS up to 20 GHz, and outperforms SIwave in accuracy.
Citation
Boping Wu, and Leung Tsang, "Full-Wave Modeling of Multiple Vias Using Differential Signaling and Shared Antipad in Multilayered High Speed Vertical Interconnects," Progress In Electromagnetics Research, Vol. 97, 129-139, 2009.
doi:10.2528/PIER09091707
References

1. Wu, D., Y. Fan, M. Zhao, and B. Zheng, "Vertical transition and power divider using via walled circular cavity for multilayer millimeter wave module," Journal of Electromagnetic Waves and Applications, Vol. 23, 729-735, 2009.
doi:10.1163/156939309788019840

2. Rimolo-Donadio, R., X. Gu, Y. H. Kwark, M. B. Ritter, B. Archambeault, F. de Paulis, Y. Zhang, J. Fan, H. BrÄuns, and C. Schuster, "Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz," IEEE Trans. Microw. Theory Tech., Vol. 57, 2072-2083, 2009.
doi:10.1109/TMTT.2009.2025470

3. Tsang, L., H. Chen, C.-C. Huang, and V. Jandhyala, "Modeling of multiple scattering among vias in planar waveguides using Foldy-Lax equations," Micro. Opt. Technol. Lett., Vol. 31, 201-208, 2001.
doi:10.1002/mop.1398

4. Tsang, L., H. Chen, C.-C. Huang, and V. Jandhyala, "Methods for modeling interactions between massively coupled multiple vias in multilayered electronic packaging structures,", U.S. Patent 7149666, Dec. 12, 2006.
doi:10.1002/mop.1398

5. Wu, B. and L. Tsang, "Modeling multiple vias with arbitrary shape of antipads and pads in high speed interconnect circuits," IEEE Microw. Wireless Compon. Lett., Vol. 19, 12-14, 2009.
doi:10.1109/LMWC.2008.2008532

6. Wu, B. and L. Tsang, "Signal integrity analysis of package and printed circuit board with multiple vias in substrate of layered dielectrics," IEEE Trans. Adv. Packag., in press, 2009.

7. Liu, E.-X., E.-P. Li, Z. Z. Oo, X.Wei, Y. Zhang, and R. Vahldieck, "Novel methods for modeling of multiple vias in multilayered parallel-plate structures," IEEE Trans. Microw. Theory Tech., Vol. 57, 1724-1733, 2009.
doi:10.1109/TMTT.2009.2022883

8. UWEE Via Tool. Ver. 2.21, Laboratory of Applications and Computations in Electromagnetics and Optics, University of Washington, Seattle, WA, Jul. 2009, [Online] Available: www.ee.washington.edu/research/laceo/Via Tool/.

9. HFSSTM. Ver. 11.0, Ansoft Corporation, Pittsburgh, PA, Dec. 2008, [Online] Available: www.ansoft.com/products/hf/hfss/.

10. Gu, X., B. Wu, C. Baks, and L. Tsang, "Fast full wave analysis of PCB via arrays with model-to-hardware correlation," Proc. IEEE Electrical Performance of Electronic Packaging and Systems Conf. (EPEP'09), Portland, Oregon, USA, 2009.

11. Wu, B. and L. Tsang, "Signal integrity analysis for 3D high-speed interconnects using Foldy-Lax multiple scattering equations," Progress In Electromagnetics Research Symposium Abstracts, Vol. 640, Beijing, China, March 23-27, 2009.

12. Sadiku, M. N. O., Numerical Techniques in Electromagnetics, 2nd Ed., CRC, Boca Raton, FL, 2001.

13., SIwaveTM Ver. 3.5, Ansoft Corporation, Pittsburgh, PA, Dec. 2008, [Online] Available: www.ansoft.com/products/si/siwave/.

14. Huang, C. C., L. Tsang, and C. H. Chan, "Multiple scattering among vias in lossy planar waveguides using SMCG method," IEEE Trans. Adv. Packag., Vol. 25, 181-188, 2002.
doi:10.1109/TADVP.2002.803262

15. Ong, C.-J., D. Miller, L. Tsang, B. Wu, and C.-C. Huang, "Application of the Foldy Lax multiple scattering method to the analysis of vias in ball grid arrays and interior layers of printed circuit boards," Micro. Opt. Technol. Lett., Vol. 49, 225-231, 2007.
doi:10.1002/mop.22091

16. Sha, W., X.-L. Wu, Z.-X. Huang, and M.-S. Chen, "Waveguide simulation using the high-order symplectic finite-difference time-domain scheme," Progress In Electromagnetics Research B, Vol. 13, 237-256, 2009.
doi:10.2528/PIERB09012302