1. Swaminathan, M., D. Chung, S. Grivet-Talocia, K. Bharath, V. Laddha, and J. Xie, "Designing and modeling for power integrity," IEEE Trans. Electromagn. Compat., Vol. 52, No. 2, 288-310, May 2010.
doi:10.1109/TEMC.2010.2045382 Google Scholar
2. Li, E.-P., X.-C. Wei, A. C. Cangellaris, E.-X. Liu, Y.-J. Zhang, M. D’Amore, J. Kim, and T. Sudo, "Progress review of electromagnetic compatibility analysis technologies for packages, printed circuit boards, and novel interconnects," IEEE Trans. Electromagn. Compat., Vol. 52, No. 2, 248-265, May 2010.
doi:10.1109/TEMC.2010.2048755 Google Scholar
3. Leone, M., "The radiation of a rectangular power-bus structure at multiple cavity-mode resonances," IEEE Trans. on Microw. Theory and Tech., Vol. 45, No. 3, 486-492, Aug. 2003. Google Scholar
4. Shim, H.-W. and T. H. Hubing, "A closed-form expression for estimating radiated emissions from the power planes in a populated printed circuit board," IEEE Trans. Electromagn. Compat., Vol. 48, No. 1, 74-81, Feb. 2006.
doi:10.1109/TEMC.2005.861377 Google Scholar
5. Kim, J.-H. and M. Swaminathan, "Modeling of irregular shaped power distribution planes using transmission matrix method," IEEE Transactions on Advanced Packaging, Vol. 24, No. 3, 334-346, 2001.
doi:10.1109/6040.938301 Google Scholar
6. Ye, X., M. Y. Koledintseva, M. Li, and J. L. Drewniak, "DC power-bus design using FDTD modeling with dispersive media and surface mount technology components," IEEE Trans. Electromagn. Compat., Vol. 43, No. 4, 579-587, Nov. 2001. Google Scholar
7. Ege Engin, A., K. Bharath, and M. Swaminathan, "Multilayered finite-difference method (MFDM) for modeling of package and printed circuit board planes," IEEE Trans. Electromagn. Compat., Vol. 49, No. 2, 441-447, May 2007.
doi:10.1109/TEMC.2007.893331 Google Scholar
8. Arcioni, P., M. Bozzi, M. Bressan, G. Conciauro, and L. Perregrini, "The BI-RME method: An historical overview," 2014 International Conference on Numerical Electromagnetic Modeling and Optimization for RF, Microwave, and Terahertz Applications (NEMO), May 14-16, 2014. Google Scholar
9. Tsang, L. and D. Miller, "Coupling of vias in electronic packaging and printed circuit board structures with finite ground plane," IEEE Transactions on Advanced Packaging, Vol. 26, No. 4, 375-384, Nov. 2003.
doi:10.1109/TADVP.2003.821081 Google Scholar
10. Zhang, Y.-J. and J. Fan, "A generalized multiple scattering method for dense vias with axially-anisotropic modes in an arbitrarily-shaped plate pair," IEEE Trans. on Microw. Theory and Tech., Vol. 60, No. 7, 2035-2045, Jul. 2012.
doi:10.1109/TMTT.2012.2195195 Google Scholar
11. Chang, X. and L. Tsang, "Fast and broadband modeling method for multiple vias with irregular antipad in arbitrarily shaped power/ground planes in 3-D IC and packaging based on generalized Foldy-Lax equations," IEEE Trans. Compon. Packag. Manuf. Technol., Vol. 4, No. 4, 685-696, Apr. 2014.
doi:10.1109/TCPMT.2013.2290897 Google Scholar
12. Tsang, L. and S. Huang, "Full wave modeling and simulations of the waveguide behavior of printed circuit boards using a broadband Green's function technique,", Provisional U.S. Patent No. 62/152.702, Apr. 24, 2015. Google Scholar
13. Huang, S., "Broadband Green's function and applications to fast electromagnetic analysis of high-speed interconnects,", Ph.D. dissertation, Dept. Elect. Eng., Univ. Washington, Seattle, WA, Jun. 2015. Google Scholar
14. Huang, S. and L. Tsang, "Broadband Green’s function and applications to fast electromagnetic modeling of high speed interconnects," IEEE International Symposium on Antennas and Propagation, Vancouver, BC, Canada, Jul. 2015. Google Scholar
15. Ishimaru, A., Electromagnetic Wave Propagation, Radiation, and Scattering, Prentice-Hall, 1991.
16. Tsang, L., J. A. Kong, K. H. Ding, and C. Ao, Scattering of Electromagnetic Waves, Volume 2, Numerical Simulations, Wiley, 2001.
doi:10.1002/0471224308
17. Tsang, L., H. Chen, C. C. Huang, and V. Jandhyala, "Modeling of multiple scattering among vias in planar waveguides using Foldy-Lax equations," Microw. Opt. Tech. Lett., Vol. 31, 201-208, Nov. 2001. Google Scholar
18. Chen, H., Q. Li, L. Tsang, C. C. Huang, and V. Jandhyala, "Analysis of large number of vias and differential signaling in multi-layered structures," IEEE Trans. on Microw. Theory and Tech., Vol. 51, 818-829, Mar. 2003.
doi:10.1109/TMTT.2003.808616 Google Scholar
19. Gu, X., B. Wu, C. Baks, and L. Tsang, "Fast full wave analysis of PCB via arrays with model-to-hardware correlation," IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS'09), 175-178, 2009. Google Scholar
20. Wu, B. and L. Tsang, "Modeling multiple vias with arbitrary shape of antipads and pads in high speed interconnect circuits," IEEE Microwave and Wireless Comp. Lett., Vol. 19, 12-14, 2009. Google Scholar
21. Tsang, L. and X. Chang, "Modeling of vias sharing the same antipad in planar waveguide with boundary integral equation and group T matrix method," IEEE Trans. Compon. Packag. Manuf. Technol., Vol. 3, No. 2, 315-327, Feb. 2013.
doi:10.1109/TCPMT.2012.2220771 Google Scholar