1. Giri, D. V. and F. M. Tesche, "Classification of intentional electromagnetic environments (IEME)," IEEE Transaction on Electromagnetic Compatibility, Vol. 46, No. 3, 322-328, 2004.
doi:10.1109/TEMC.2004.831819 Google Scholar
2. Chen, C. H., C. L. Liu, C. C. Chiu, and T. M. Hu, "Ultrawide band channel calculation by SBR/image techniques for indoor communication," Journal of Elelctromagnetics Wave and Applications, Vol. 20, No. 1, 41-51, 2006.
doi:10.1163/156939306775777387 Google Scholar
3. Zhang, M. T., Y. B. Chen, Y. C. Jiao, and F. S. Zhang, "Dual circularly polarized antenna of compact structure for RFID application," Journal of Elelctromagnetics Wave and Applications, Vol. 20, No. 14, 1895-1902, 2006.
doi:10.1163/156939306779322611 Google Scholar
4. Albagory, Y., "A novel design of arbitrary shaped cells for efficient coverage from high altitude platforms," Progress In Electromagnetics Research Letters, Vol. 1, 245-254, 2008.
doi:10.2528/PIERL07120505 Google Scholar
5. Mohammadi, F. A. and M. C. E. Yagoub, "Electromagnetic model for microwave components of integrated circuits," Progress In Electromagnetics Research B, Vol. 1, 81-94, 2008.
doi:10.2528/PIERB07101802 Google Scholar
6. Tu, T. C. and C. C. Chiu, "path loss reduction in an urban area by genetic algorithms," Journal of Elelctromagnetics Wave and Applications, Vol. 20, No. 3, 319-330, 2006.
doi:10.1163/156939306775701696 Google Scholar
7. Soliman, M. S., T. Morimoto, and Z. I. Kawasaki, "Threedimensional localization system for impulsive noise sources using ultra-wideband digital interferometer technique," Journal of Elelctromagnetics Wave and Applications, Vol. 20, No. 4, 515-530, 2006.
doi:10.1163/156939306776117027 Google Scholar
8. Golestani-Rad, L. and J. Rashed-Mohassel, "Rigorous analysis of EM-wave penetration into a typical room using FDTD method: The transfer function concept," Journal of Elelctromagnetics Wave and Applications, Vol. 20, No. 7, 913-926, 2006.
doi:10.1163/156939306776149851 Google Scholar
9. Bäckström, M. G. and LovstrandK. G., "Susceptibility of electronic systems to high-power microwaves: Summary of test experience," IEEE Transaction on Electromagnetic Compatibility, Vol. 46, No. 3, 396-403, 2004.
doi:10.1109/TEMC.2004.831814 Google Scholar
10. Radaky, W. A. and C. E. Baum, "Introduction to the special issue on high-power electromagnetics (HPEM) and intentional electromagnetic interference (IEMI)," IEEE Transaction on Electromagnetic Compatibility, Vol. 46, No. 3, 314-321, 2004.
doi:10.1109/TEMC.2004.831899 Google Scholar
11. Bäckström, M. G., "Susceptibility of electronic systems to high power microwaves: Summary of test experience," IEEE Transactions on Electromagnetic Compatibility, Vol. 46, No. 3, 2004. Google Scholar
12. Bäckström, M. G., "The threat from intentional EMI against the civil technical infrastructure," Reprint from ESW2006, 16-19, 2006. Google Scholar
13. Taylor, D. and D. V. Giri, High-power Microwave Systems and Effects, Taylor & Francis, 1994.
14. Ali, M. and S. Sanyal, "FDTD analysis of rectangular waveguide in receiving mode as EMI sensors," Progress In Electromagnetics Research B, Vol. 2, 291-303, 2008.
doi:10.2528/PIERB07112901 Google Scholar
15. Camp, M., H. Garbe, and D. Nitsch, "Influence of the technology on the destruction effects of semiconductors by impact of EMP and UWB pulses," IEEE Trans. on EMC, Vol. 1, 87-92, 2002. Google Scholar
16. ``JESD78 latch-up testing standard, '' Electronic Industry Association JEDEC standards, "16. JESD78 latch-up testing standard," Electronic Industry Association JEDEC standards. Google Scholar
17. Camp, M., H. Gerth, H. Garbe, and H. Haase, "Predicting the breakdown behavior of microcontrollers under EMP/UWB impact using a statistical analysis," IEEE Trans. on Electromagnetic Compatibility, Vol. 46, 368-379, 2004.
doi:10.1109/TEMC.2004.831816 Google Scholar
18. Estreich, D. B., "The physics and modeling of latch-up and CMOS integrated circuits," Stanford Electron. Labs., No. 11, 201-9, 1980. Google Scholar
19. Korte, S., M. Camp, and H. Garbe, "Hardware and software simulation of transient pulse impact on integrated circuits," IEEE Trans. on Electromagnetic Compatibility, Vol. 2, 489-494, 2005. Google Scholar