volume | PIER Journals

Abstract

According to the derived transfer function using different orders of approximation, stability and signal transmission analysis of a driven metallic single-walled carbon nanotube (SWCNT) bundle interconnect are performed. It is shown that as the length of SWCNT bundle interconnect increases, the poles will be closer to the imaginary axis, which causes the transmitted signal response tends to be more damping. Using the fourth-order approximation of the transfer function, the transmitted pulse waveform along the SWCNT bundle interconnect is captured accurately, with signal overshoot and time delay examined. Further, a complete physical model for the transient response of carbon nanotube bundle interconnect is derived, which can also accurately predict the transient response of carbon nanotube bundle interconnect including time delay and crosstalk.

1. Li, H., C. Xu, N. Srivastava, and K. Banerjee, "Carbon nanomaterials for next-generation interconnects and passives: Physics, status, and prospects," IEEE Trans. Electron. Device, Vol. 56, No. 9, 1799-1821, Sep. 2009.
doi:10.1109/TED.2009.2026524 Google Scholar

2. Burke, P. J., "An RF circuit model for carbon nanotubes," IEEE Trans. Nanotech., 55-58, Mar. 2003.
doi:10.1109/TNANO.2003.808503 Google Scholar

3. Naeemi, A. and J. D. Meindl, "Compact physical model for multiwall carbon nanotube interconnect," IEEE Trans. Electron. Device Lett., Vol. 27, No. 5, 338-340, May 2006.
doi:10.1109/LED.2006.873765 Google Scholar

4. Li, H., W. Y. Yin, K. Banerjee, and J. F. Mao, "Circuit modeling and performance analysis of multi-walled carbon nanotube interconnects ," IEEE Trans. Electron. Device, Vol. 55, No. 6, 1328-1337, Jun. 2008.
doi:10.1109/TED.2008.922855 Google Scholar

5. Maffucci, A., G. Miano, and F. Villone, "A new circuit model for carbon nanotube interconnects with diameter-dependent parameters," IEEE Trans. Nanotech., Vol. 8, No. 3, 345-354, May 2009.
doi:10.1109/TNANO.2008.2010545 Google Scholar

6. Nieuwoudt, A. and Y. Massoud, "Understanding the impact of inductance in carbon nanotube bundles for VLSI interconnect using scalable modeling techniques," IEEE Trans. Nanotech., Vol. 5, No. 6, 758-765, Nov. 2006.
doi:10.1109/TNANO.2006.883480 Google Scholar

7. Haruehanroengra, S. and W. Wang, "Analyzing conductance of mixed carbon-nanotube bundles for interconnect applications," IEEE Electron. Device Lett., Vol. 28, No. 8, 756-759, Aug. 2007.
doi:10.1109/LED.2007.901584 Google Scholar

8. Wang, W., S. Haruehantoengra, L. Shang, and M. Liu, "Inductance of mixed carbon nanotube bundles," Micro. & Nano. Lett., Vol. 2, No. 2, 35-39, Jun. 2007.
doi:10.1049/mnl:20070027 Google Scholar

9. Rossi, D., J. M. Cazeaux, C. Metra, and F. Lombardi, "Modeling crosstalk effects in CNT bus architectures," IEEE Trans. Nanotech., Vol. 6, No. 2, 133-145, Mar. 2007.
doi:10.1109/TNANO.2007.891814 Google Scholar

10. Pu, S. N., W. Y. Yin, J. F. Mao, and Q. H. Liu, "Crosstalk prediction of single- and double-walled carbon-nanotube (SWCNT/DWCNT) bundle interconnects," IEEE Trans. Electron. Devices, Vol. 55, No. 4, 560-568, Apr. 2009.
doi:10.1109/TED.2009.2014429 Google Scholar

11. Naeemi, A., R. Sarvari, and J. D. Meindl, "Performance comparison between carbon nanotube and copper interconnects for gigascale integration (GSI) ," IEEE Electron. Device Lett., Vol. 26, No. 2, 84-86, Feb. 2005.
doi:10.1109/LED.2004.841440 Google Scholar

12. Naeemi, A. and J. D. Meindl, "Design and performance modeling for single-walled carbon nanotubes as local, semi-global, and global interconnects in gigascale integrated systems," IEEE Trans. Electron. Devices, Vol. 54, No. 1, 26-37, 2007.
doi:10.1109/TED.2006.887210 Google Scholar

13. Srivastava, N., H. Li, F. Kreupl, and K. Banerjee, "On the applicability of single-walled carbon nanotubes as VLSI interconnects," IEEE Trans. Nanotech., Vol. 8, No. 4, 542-559, Jul. 2009.
doi:10.1109/TNANO.2009.2013945 Google Scholar

14. Fathi, D. and B. Forouzandeh, "A novel approach for stability analysis in carbon nanotube interconnects," IEEE Electron. Device Lett., Vol. 30, No. 5, 475-477, May 2009.
doi:10.1109/LED.2009.2017388 Google Scholar

15. Chen, W. C., W. Y. Yin, J. Lei, and Q. H. Liu, "Electrothermal characterization of single-walled carbon nanotube (SWCNT) interconnect arrays," IEEE Trans. Nanotech., Vol. 8, No. 6, 718-728, 2009.
doi:10.1109/TNANO.2009.2019725 Google Scholar

16. Patil, N., J. Deng, A. Lin, H. S. P. Wong, and S. Mitra, "Design methods for misaligned and mispositioned carbon-nanotube immune circuits," IEEE Trans. Computer-aided Design of Integrated Circuits and Systems, Vol. 27, No. 10, 1725-1746, Oct. 2008.
doi:10.1109/TCAD.2008.2003278 Google Scholar

17. Close, G. F. and H. S. P. Wong, "Assembly and electrical characterization of multiwall carbon nanotube interconnects," IEEE Trans. Nanotech., Vol. 7, No. 5, 596-600, Sep. 2008.
doi:10.1109/TNANO.2008.927373 Google Scholar

18. Patil, N., A. Lin, E. R. Myers, K. Ryu, A. Badmaev, C. W. Zhou, and H. S. P. Wong, "Wafer-scale growth and transfer of aligned single-walled carbon nanotubes," IEEE Trans. Nanotech., Vol. 8, No. 4, 498-504, Jul. 200.
doi:10.1109/TNANO.2009.2016562 Google Scholar

19. Lin, A., N. Patil, H. Wei, S. Mitra, and H. S. P. Wong, "ACCNT-a metallic-CNT-tolerant design methodology for carbon-nanotube VLSI: concepts and experimental demonstration," IEEE Trans. Electron. Device, Vol. 56, No. 12, 2969-2978, Dec. 2009.
doi:10.1109/TED.2009.2033168 Google Scholar

20. Banerjee, K. and A. Mehrotra, "Analysis of on-chip inductance effects for distributed RLC interconnects," IEEE Trans. Computeraided Designs of Integrated Circuits and Systems, Vol. 21, No. 5, 904-915, Aug. 2002.
doi:10.1109/TCAD.2002.800459 Google Scholar

21. Davis, J. A. and J. D. Meindl, "Compact distributed RLC interconnect models --- Part I: Single line transient, time delay, and overshoot expressions," IEEE Trans. Electron. Device, Vol. 47, No. 11, 2068-2077, Nov. 2000.
doi:10.1109/16.877168 Google Scholar

22. Davis, J. A. and J. D. Meindl, "Compact distributed RLC interconnect models --- Part II: Coupled line transient expressions and peak crosstalk in multilevel networks," IEEE Trans. Electron. Device, Vol. 47, No. 11, 2078-2087, Nov. 2000.
doi:10.1109/16.877169 Google Scholar

23. Venkatesan, R., J. A. Davis, and J. D. Meindl, "Compact distributed RLC interconnect models --- Part III: Transients in single and coupled lines with capacitive load termination," IEEE Trans. Electron. Device, Vol. 50, No. 4, 1081-1093, Apr. 200.
doi:10.1109/TED.2003.812507 Google Scholar

24. Venkatesan, R., J. A. Davis, and J. D. Meindl, "Compact distributed RLC interconnect models --- Part IV: Unified models for time delay, crosstalk, and repeater insertion," IEEE Trans. Electron. Device, Vol. 50, No. 4, 1094-1102, Apr. 2003.
doi:10.1109/TED.2003.812509 Google Scholar

25. Fathi, D. and B. Forouzandeh, "Time domain analysis of carbon nanotube interconnects based on distributed RLC model," Nano., Vol. 4, No. 1, 13-21, 2009.
doi:10.1142/S1793292009001484 Google Scholar

26. Fathi, D., Forouzandeh, S. Mohajerzadeh, and R. Sarvari, "Accurate analysis of carbon nanotube interconnects using transmission line model," Micro & Nano Lett., Vol. 4, No. 2, 116-121, 2009.
doi:10.1049/mnl.2009.0045 Google Scholar

27. Davis, J. A., A hierarchy of interconnect limits and opportunities for gigascale integration (GSI) , Ph.D. dissertation, Univ. Georgia Institute of Technology, Mar. 1999.

28. Sarto, M. S., A. Tamburrano, and M. D'Amore, "New electron-waveguide-based modeling for carbon nanotube interconnects," IEEE Trans. Nanotechnology, Vol. 8, No. 2, 214-225, 2008.
doi:10.1109/TNANO.2008.2010253 Google Scholar

29. Raguraman, V., Multilevel interconnect architectures for gigascale integration (GSI), Ph.D. dissertation, Georgia Institute of Technology, Feb. 2003.

30. Khalaj-Amirhosseini, M., "Closed form solutions for nonuniform transmission lines," Progress In Electromagnetics Research B, Vol. 2, 243-258, 2008.
doi:10.2528/PIERB07111502 Google Scholar

31. Chiu, C.-N. and I.-T. Chiang, "A fast approach for simulating long-time response of high-speed dispersive and lossy interconnects terminated with nonlinear loads," Progress In Electromagnetics Research, Vol. 91, 153-171, 2009.
doi:10.2528/PIER09021502 Google Scholar

32. Wang, Y. J., W. J. Koh, C. K. Lee, and K. Y. See, "Electromagnetic coupling analysis of transient signal through slots or apertures perforated in a shielding metallic enclosure using FDTD methodology," Progress In Electromagnetics Research, Vol. 36, 247-264, 2002.
doi:10.2528/PIER02021701 Google Scholar

Dr. Jiang-Peng Cui

Dr. Wen-Yan Yin